Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Kentaro Kasa

Manabu Takakuwa

Yosuke Okamoto

Kazuya Fukuhara

Kazuhiro Segawa

Takashi Sato

Tetsuro Nakasugi

Ryoichi Inanami

Nobuhiro Komine

Hiroshi Koizumi

Tetsuya Kugimiya

Kazuto Matsuki

Kazutaka Ishigo

Yoshinori Hagio

Yuu Yamayose

Minoru Inomoto

Yuki Murasaka

Masamichi Kishimoto

In one embodiment, a substrate processing control apparatus includes a position information acquiring module configured to acquire information about a position of a first pattern that is formed in a substrate for a photomask to change an applied stress to the substrate or a transmittance of the substrate. The apparatus further includes a position determining module configured to determine, in accordance with the information about the position of the first pattern, a position of a second pattern to be formed in the substrate to change the applied stress to the substrate or the transmittance of the substrate.

Substrate processing control apparatus, recording medium, and method of manufacturing photomask

According to an embodiment, a first resist pattern that includes a mark including a second pattern provided with first components and a third pattern not provided with the first components is formed. Then, a first recessed area is formed on a processing target layer using the first resist pattern. Thereafter, a second resist pattern that includes a fourth pattern is formed. The fourth pattern is formed such that the third pattern and part of the second pattern, which includes at least one row of the first components arranged along a periphery of the third pattern, are exposed. Then, a second recessed area is formed by using the second resist pattern. Thereafter, a position of the processing target layer is recognized by using a stepped portion formed at the second recessed area, in a light exposure apparatus, and a third resist pattern is formed.

Semiconductor device manufacturing method and semiconductor wafer

According to one embodiment, an imprint device includes a holding unit, a mounting unit, a moving unit, a curing unit, a pressing portion, and a detecting portion. The holding unit holds template having a pattern portion pressed onto a transfer portion provided on a substrate. The mounting unit mounts the substrate. The moving unit is provided on at least either the holding unit or the mounting unit. The moving unit moves the holding unit and the mounting unit in directions approaching each other or directions away from each other. The curing unit cures the transfer portion onto which the pattern portion of the template is pressed. The pressing portion pushes the template pressed onto the transfer portion in a direction intersecting a pressing direction of the template. The detecting portion detects a position of the template pushed by the pressing portion.

Imprint device and pattern forming method

A pattern accuracy detecting apparatus includes a stage for supporting a substrate, an optical warpage detecting unit that measures a shape of a substrate disposed on the stage, an optical pattern detection unit that detects a position of a pattern on the substrate, and a processing unit that corrects the detected pattern position based on the measured shape of the substrate.

Pattern accuracy detecting apparatus and processing system

According to one embodiment, a substrate holding apparatus includes a main unit and a plurality of first support units. The main unit has a major surface. The main unit has a plate configuration. The first support units are disposed on the major surface. Each of the first support units includes a suction-holding unit capable of holding a substrate by suction. The suction-holding unit is movable along a first direction perpendicular to the major surface and a second direction parallel to the major surface.

Substrate holding apparatus, pattern transfer apparatus, and pattern transfer method

An exposure apparatus according to an embodiment controls the positioning between layers using an alignment correction value calculated on the basis of lower layer position information of a lower-layer-side pattern and upper layer position information of an upper-layer-side pattern. The lower layer position information includes alignment data, a focus map, and a correction value which is set on the basis of the previous substrate. The upper layer position information includes alignment data, a focus map, and a correction value which is a correction value for the positioning and is used when the upper-layer-side pattern is transferred.

Exposure apparatus, exposure method, and method of manufacturing semiconductor device

According to one embodiment, a pattern measurement apparatus includes a scan controller, a focus controller, a stage, a sensor, a signal processor, and a measurement unit. The scan controller is configured to control a scanning direction of an electron beam. The focus controller is configured to control a focus position of the electron beam. The stage is configured to have a substrate placed on the stage, a pattern being provided in the substrate. The sensor is configured to sense secondary electrons due to the electron beam irradiated onto the pattern. The signal processor is configured to process a signal sensed by the sensor. The signal processor is configured to determine at least one of third signals from at least one of first signals and at least one of second signals. The measurement unit is configured to measure a position of the pattern from the third signals.

Pattern measurement apparatus and pattern measurement method

A mask pattern includes a first pattern having a line-and-space pattern extending in a first direction, a second pattern formed as a line-and-space pattern having a larger period than the first pattern and extending in the first direction, a third pattern having a line-and-space pattern extending in a second direction, and a fourth pattern formed as a line-and-space pattern having a larger period than the third pattern and extending in the second direction. Illumination light is obliquely incident on the first pattern and the second pattern from a first oblique direction, illumination light is obliquely incident on the third pattern and the fourth pattern from a second oblique direction, and a relative distance from the first pattern to the second pattern transferred on to an image receptor and a relative distance from the third pattern to the fourth pattern transferred onto the image receptor are measured and an optical characteristic of an exposure apparatus is ascertained based on the relative distances.

Growing community of inventors

Nagoya, Japan

Kentaro Kasa