Toshiba Memory Corporation

Kabushiki Kaisha Toshiba

Kioxia Corporation

Kenta Yamada

Ryota Suzuki

Masao Shingu

Masaaki Higuchi

Hirokazu Ishigaki

Fumitaka Arai

Shigeki Kobayashi

Satoshi Nagashima

Wataru Sakamoto

Yoshimasa Mikajiri

Takayuki Okada

Hideto Takekida

Ryota Fujitsuka

Hisataka Meguro

Daigo Ichinose

Shigeru Kinoshita

Shinichi Sotome

Yasuhiro Uchiyama

Ryosuke Sawabe

Keisuke Suda

Satoshi Konagai

Nobushi Matsuura

Atsushi Konno

Hiroki Kishi

Takanori Yamanaka

Takashi Yamane

Soichiro Kitazaki

A semiconductor storage device includes a first stack including a plurality of first electrode films stacked in a first direction. A second stack is provided above the first stack and includes a plurality of second electrode films that are stacked in the first direction. A first column portion is provided in the first stack to extend in the first direction and includes a first charge storage film and a first semiconductor layer. A second column portion is provided in the second stack to extend in the first direction and includes a second charge storage film and a second semiconductor layer. A connecting portion is provided between the first column portion and the second column portion, divides the first charge storage film and the second charge storage film from each other, and is configured to electrically connect the first semiconductor layer and the second semiconductor layer to each other.

Semiconductor storage device including a low on-resistance joint between arrays

A semiconductor memory device includes memory blocks arranged in a first direction and bit lines that are arranged in a second direction, and are arranged with the memory blocks in a third direction. The memory block includes first conductive layers arranged in the third direction, a second conductive layer disposed on a side opposite to the bit lines in the third direction with respect to the first conductive layers, semiconductor layers that extend in the third direction, are opposed to the first conductive layers, have one ends in the third direction electrically connected to the second conductive layer, and have the other ends in the third direction electrically connected to the bit lines, and electric charge accumulating films disposed between the first conductive layers and the semiconductor layers. The first conductive layers and the second conductive layer are separated between the memory blocks.

Semiconductor memory device with conductive layers separated between memory blocks

A semiconductor memory device according to an embodiment includes a semiconductor substrate; a laminated body formed by laminating a plurality of electrode layers on the semiconductor substrate; a memory film provided in the laminated body and including a first block insulation film disposed in a direction perpendicular to the electrode layer, a charge storage film facing the first block insulation film, a tunnel insulation film facing the charge storage film, and a channel film facing the tunnel insulation film; and a barrier layer provided at at least one of interface between the plurality of electrode layers and the memory film and an interface in the memory film and mainly composed of carbon.

Semiconductor memory device

According to one embodiment, a semiconductor device includes a substrate, a stacked body, and a columnar portion. The stacked body, provided on the substrate, includes first conductive layers and first insulating layers provided alternately along a first direction. The columnar portion extends through the stacked body in the first direction. The columnar portion includes a blocking layer, a charge storage layer, a tunneling layer, and a semiconductor layer. The columnar portion includes a first portion and a second portion. The second portion is provided on the substrate side of the first portion. A dimension in the second direction of the second portion is smaller than a dimension in a second direction of the first portion. A portion of the blocking layer is provided at the second portion being thicker than a portion of the blocking layer provided at the first portion.

Semiconductor device including a blocking layer having a varying thickness

According to an embodiment, a semiconductor memory device comprises: a stacked body including control gate electrodes stacked upwardly of a substrate; a semiconductor layer facing the control gate electrodes; and a gate insulating layer provided between the control gate electrode and the semiconductor layer. The stacked body comprises: a first metal layer configuring the control gate electrode; a first barrier metal layer contacting an upper surface of this first metal layer; a first silicon nitride layer contacting an upper surface of this first barrier metal layer; a first inter-layer insulating layer contacting an upper surface of this first silicon nitride layer; a second barrier metal layer contacting a lower surface of the first metal layer; a second silicon nitride layer contacting a lower surface of this second barrier metal layer; and a second inter-layer insulating layer contacting a lower surface of this second silicon nitride layer.

A semiconductor memory device includes a conductive layer; electrode layers stacked on the conductive layer; an insulating body extending through the electrode layers; and a semiconductor layer positioned between the insulating body and the electrode layers. The plurality of electrode layers include a first electrode layer, a second electrode layer provided between the conductive layer and the first electrode layer, and a third electrode layer provided between the conductive layer and the second electrode layer, and the semiconductor layer has a first layer thickness between the insulating body and the first electrode layer, a second layer thickness between the insulating body and the second electrode layer and a third layer thickness between the insulating body and the third electrode layer. The first layer thickness is thinner than the second layer thickness, and the second layer thickness is thinner than the third layer thickness.

Semiconductor memory device and method for manufacturing same

According to the embodiment, the semiconductor device includes: a substrate; a stacked body; and a plurality of columnar portions. The stacked body is provided on the substrate. The stacked body includes a plurality of electrode layers stacked with an insulator interposed. The stacked body includes a stacked portion and a staircase portion. The plurality of electrode layers includes a first portion and a second portion. The columnar portions are provided in the stacked portion of the stacked body. The columnar portions extend in a stacking direction of the stacked body. The columnar portions include a semiconductor body extending in the stacking direction and a charge storage film. The second portion includes a third portion. A thickness of the third portion along the stacking direction is thinner than a thickness of the first portion along the stacking direction.

Semiconductor device and method for manufacturing same

A semiconductor memory device includes a substrate, a plurality of first control gate electrodes, a plurality of second control gate electrodes, first to second select gate electrodes, first to second gate electrodes, a bit line, first to second semiconductor pillars, and a controller. The controller applies a first potential to the first select gate electrode, a third potential lower than the first potential to the second select gate electrode, a second potential to the first gate electrode and the second gate electrode, a selecting potential not less than the third potential to one of the plurality of the first control gate electrodes, and an unselecting potential higher than the selecting potential to other than the one of the plurality of first control gate electrodes in a reading operation.

According to an embodiment, a non-volatile memory device includes a memory cell including a semiconductor layer, a charge storage layer provided on the semiconductor layer, and a first insulating film provided between the semiconductor layer and the charge storage layer. The device also includes a first conductive layer provided on the charge storage layer, a second conductive layer provided between the charge storage layer and the first conductive layer, a second insulating film provided between the charge storage layer and the second conductive layer, and a third insulating film provided between the first conductive layer and the second conductive layer.

Non-volatile memory device and method for manufacturing same

Nonvolatile semiconductor memory device includes first memory cell array layer, first insulating layer formed thereabove, and second memory cell array layer formed thereabove. First memory cell array layer includes first NAND cell units each including plural first memory cells. The first memory cell includes first semiconductor layer, first gate insulating film formed thereabove, and first charge accumulation layer formed thereabove. The second memory cell array layer includes second NAND cell units each including plural second memory cells. The second memory cell includes second charge accumulation layer, second gate insulating film formed thereabove, and second semiconductor layer formed thereabove. Control gates are formed, via an inter-gate insulating film, on first-direction both sides of the first and second charge accumulation layers positioned the latter above the former via the first insulating layer. The control gates extend in a second direction perpendicular to the first direction.

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Yokkaichi, Japan

Kenta Yamada