Renesas Electronics Corporation

Nec Corporation

Nec Electronics Corporation

Konami Digital Entertainment Co., Ltd.

Renesas Electronics Coporation

Kenta Ogawa

Shintaro Yamamichi

Yasutaka Nakashiba

Takehiko Maeda

Jun Tsukano

Katsumi Kikuchi

Hideya Murai

Takuo Funaya

Hirokazu Honda

Yuji Fujishiro

Junichi Taya

Yugo Kishino

Hideto Nishiyama

Masaki Nakamura

Kei Masuda

Taku Hamasaki

Kentaro Mori

Tadanori Shimoto

Kazuhiro Baba

Shota Kobayashi

Hideki Yanagihara

Masatoshi Ojima

Yasuhiro Matsumaru

Shuto Aoyagi

A non-transitory computer readable storage medium according to the present invention stores a computer program causing a control unit of a game device, which provides a soccer game that includes a normal shot that follows a rule that the movement speed and climb angle of a ball increase according to the duration of an operation of a left operation button of a controller, to function as the following device. That is, the computer program causes the control unit to function as a device that, when an R2 button of the controller has been pressed, decides, according to the duration of the operation of the left operation button, the movement speed and climb angle of the ball in accordance with a rule which differs from that of the normal shot, and controlling display so that the ball moves at the decided movement speed and the like, as a power shot of a kind similar to the normal shot.

Game system, medium, and method for determining ball speed and climb angle

At least one memory device of a game system stores a plurality of instructions, which, when executed by at least one processor, cause the at least one processor to: set, on a touch panel, a reception area for receiving a direction designation operation; move, in accordance with a movement of a touch position on the touch panel, an operation position in a direction corresponding to a moving direction of the touch position by a distance longer than a moving distance of the touch position; acquire a designated direction based on a direction from a reference position corresponding to the reception area to the operation position; and execute game processing based on the designated direction.

Game system, game control device, and information storage medium

At least one processor of a game control device is configured to: acquire a movement direction of the touch position, when a touch position moves under a state in which a touch panel is being touched; execute first game processing based on the movement direction; detect that the movement direction has changed to any movement direction having an angle of a predetermined angle or more with respect to a movement direction acquired at a predetermined timing; and execute second game processing based on one of the movement direction before the change and the movement direction after the change, when the change in the movement direction is detected.

Game control device, game system, and information storage medium

At least one processor of a game control device is configured to: display an object on a display region, in a game in which the object is moved in accordance with an operation of a user on a touch panel; set a first region of the display region as an operation region; move the object based on the operation of the user on the operation region; and change the operation region to a second region, in which the object is prevented from being arranged at an edge portion of the second region, in a predetermined game situation, which is one of a situation in which at least a part of the object is outside the first region and a situation in which the object is arranged at an edge portion of the first region.

An external storage device including an interconnect substrate having a contact type external terminal, at least one semiconductor chip disposed over a first surface of the interconnect substrate, and a sealing resin layer which seals the at least one semiconductor chip and does not cover the external terminal. The at least one semiconductor chip includes a storage device, an inductor being connected to the storage device, a driver circuit configured to control the inductor and an interconnect layer. The interconnect layer is formed at a first surface of the semiconductor chip and includes the inductor. The first surface of the semiconductor chip is other than facing the first surface of the interconnect substrate, and the inductor and the driver circuit are connected to each other through the interconnect layer.

External storage device and method of manufacturing external storage device

This invention can reduce heat that is generated in a first semiconductor chip and transfers to a second semiconductor chip through through-silicon vias. The first semiconductor chip has the first through-silicon vias. Each of the first through-silicon vias is arranged on any of grid points arranged in m rows and n columns (m&#x3e;n). The first semiconductor chip also has a first circuit formation area. A first circuit is formed in the first circuit formation area. The first circuit performs signal processing while communicating with the second semiconductor chip. In plan view, the first circuit formation area does not overlap with a through-silicon via area that is defined by coupling the outermost grid points arranged in m rows and n columns. In plan view, some of connection terminals are located between the first circuit formation area and the through-silicon via area.

Semiconductor device

An external terminal of an electronic component is provided with a lead base material and a metal thin film coating a surface of the lead base material, and an average value of a crystal size index is not less than 7, which is defined based on dimensions of a crystal particle in a direction perpendicular to the lead base material surface and in a direction parallel thereto, taken on a cut surface of the metal thin film defined by a given plane cutting the metal thin film in a direction perpendicular to the lead base material surface. Such constitution provides an electronic component having an external terminal coated with a metal thin film of a simple structure constituted of Sn or a Sn-based and substantially Pb-free alloy, formed by plating on a surface of a lead base material.

Electronic component and method of manufacturing the same

This invention can reduce heat that is generated in a first semiconductor chip and transfers, to a second semiconductor chip through through-silicon vias. The first semiconductor chip has the first through-silicon vias. Each of the first through-silicon vias is arranged on any of grid points arranged in m rows and n columns (m&#x3e;n). The first semiconductor chip also has a first circuit formation area. A first circuit is formed in the first circuit formation area. The first circuit performs signal processing while communicating with the second semiconductor chip. In plan view, the first circuit formation area does not overlap with a through-silicon via area that is defined by coupling the outermost grid points arranged in m rows and n columns. In plan view, some of connection terminals are located between the first circuit formation area and the through-silicon via area.

A semiconductor device, includes a substrate with a first surface, a semiconductor chip disposed over the first surface of the substrate, the semiconductor chip including a first region and a second region, and an encapsulant resin formed over the first surface of the substrate and encapsulating the semiconductor chip. The encapsulant resin has a thickness that is less at the first region of the semiconductor chip than that at the second region.

Semiconductor device including a recess formed above a semiconductor chip

A first semiconductor chip and a second semiconductor chip are overlapped with each other in a direction in which a first multilayer interconnect layer and a second multilayer interconnect layer are opposed to each other. When seen in a plan view, a first inductor and a second inductor are overlapped. The first semiconductor chip and the second semiconductor chip have non-opposed areas which are not opposed to each other. The first multilayer interconnect layer has a first external connection terminal in the non-opposed area, and the second multilayer interconnect layer has a second external connection terminal in the non-opposed area.

Method of manufacturing a semiconductor device

A storage element is provided in a semiconductor chip, and an inductor and a driver circuit are provided in another semiconductor chip. An external terminal is a contact type terminal, and at least some external terminals are a power supply terminal and a ground terminal. A sealing resin layer is formed over a first surface of an interconnect substrate and seals the semiconductor chips but does not cover the external terminal. The inductor is formed at a surface of the semiconductor chip not facing the interconnect substrate.

A wiring board has an insulating layer, a plurality of wiring layers formed in such a way as to be insulated from each other by the insulating layer, and a plurality of vias formed in the insulating layer to connect the wiring layers. Of the wiring layers, a surface wiring layer formed in one surface of the insulating layer include a first metal film exposed from the one surface and a second metal film embedded in the insulating layer and stacked on the first metal film. Edges of the first metal film project from edges of the second metal film in the direction in which the second metal film spreads. By designing the shape of the wiring layers embedded in the insulating layer in this manner, it is possible to obtain a highly reliable wiring board that can be effectively prevented from side etching in the manufacturing process and can adapt to miniaturization and highly dense packaging of wires.

Method of manufacturing a wiring board

Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof

In order to solve the above problem, provided is an electronic component having an authentication pattern formed on an exposed surface, in which the authentication pattern includes a base section including a resin and colored particles having a hue that can be identified in the base section, and the colored particles are dispersed so as to form dotted pattern in the base section.

Growing community of inventors

Kanagawa, Japan

Kenta Ogawa