Kabushiki Kaisha Toshiba

The University of Electro-communications

Kenta Kuroda

Kazutaka Takagi

Kazuhiko Honjo

According to one embodiment, a high-frequency amplifier includes an active element and an output matching circuit. The active element is provided on a substrate. The active element is configured to amplify a signal having a frequency band. The active element includes a cell region. The output matching circuit is connected to the active element. The output matching circuit includes a wire, a transmission line and an output terminal. The wire includes an input end and an output end. The input end of the wire is connected to an output part of the cell region of the active element. The transmission line is provided on the substrate. The transmission line includes an input part and an output part. The input part of the transmission line is connected to the output end of the wire. The output terminal is provided on the substrate.

High-frequency amplifier

A semiconductor power amplifier comprises an input-side amplifier for inputting and amplifying an input signal, a balanced amplifier which is connected to an output terminal of the input-side amplifier, comprises two hybrid couplers and a plurality of power amplifiers, passes the input signal, and converts a reflective wave into thermal energy, and an output-side amplifier which is connected to an output terminal of the balanced amplifier and amplifies an output signal.

Semiconductor power amplifier

A microwave harmonic processing circuit includes (n&#x2212;1) parallel open ended stubs differing in length, connected in parallel to an output terminal of a serial transmission line at a single point, and having predetermined electrical lengths corresponding to second to higher n-th (n is any integer) harmonics, respectively, the serial transmission line having an input terminal connected to an output terminal of a transistor and having a predetermined electrical length; a first strip conductor connecting the serial transmission line to two parallel open ended stubs of the (n&#x2212;1) parallel open ended stubs at a single connecting point; a second strip conductor connecting the (n&#x2212;3) parallel open ended stubs to each other at a single connecting point; a ground layer disposed between first strip conductor and second strip conductor; and a via electrically connecting a connecting portion of first strip conductor and a connecting portion of second strip conductor.

Growing community of inventors

Tokyo, Japan

Kenta Kuroda