Murata Manufacturing Co., Ltd.

Kenta Kondo

Yoshiyuki Oota

Masahiro Kubota

Tomonori Sakata

Tomohiro Kido

Shimpei Tanabe

Hiromi Miyoshi

Rikiya Sano

Hiroshi Marusawa

Yasunari Nakashima

Machiko Motoya

Hiroyuki Honda

Yasuo Matsumoto

A method of manufacturing an inductor component includes preparing an insulating paste that is photosensitive and that includes a filler material composed of quartz, a glass material and a resin material, and a conductive paste, forming a first insulating layer by applying the insulating paste, and exposing the first insulating layer in a state where a first portion of the first insulating layer is shielded by a mask. The method further includes removing the first portion of the first insulating layer to form a groove at a position corresponding to the first portion, applying the conductive paste in the groove to form a coil conductor layer in the groove, and applying the insulating paste on the first insulating layer and the coil conductor layer to form a second insulating layer.

Method of manufacturing an inductor component

An inductor component includes an element assembly formed of an insulator material and an inner electrode arranged in the element assembly. The insulator material contains a base material formed of an amorphous material containing B, Si, O, and K and a crystalline filler and includes a filler-poor glass portion in a region along the inner electrode. The content of the crystalline filler in the filler-poor glass portion is lower than the content of the crystalline filler in the element assembly excluding the filler-poor glass portion.

Inductor component

A coil component includes a core having a winding core portion, a first flange portion disposed on a first end portion of the winding core portion, and a second flange portion disposed on a second end portion of the winding core portion; a wire winding on the winding core portion of the core; and a plate member disposed so as to bridge the first flange portion and the second flange portion. The coil component further includes an adhesive portion disposed between the first flange portion and the plate member and adhering the first flange portion to the plate member, and an adhesive portion disposed between the second flange portion and the plate member and adhering the second flange portion to the plate member. The adhesive portion contains a resin and magnetic powder.

Coil component

An inductor component includes a lamination of an insulating layer and a conductive layer. The insulating layer includes a base made of glass and inorganic particles dispersed in the base. Some of the inorganic particles partially project through the surface of the base into the conductive layer.

A photosensitive insulating paste according to preferred embodiments of the present disclosure contains glass frit, a first inorganic filler, a second inorganic filler, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, and a solvent. The first inorganic filler has a refractive index of 1.7 or higher. The second inorganic filler has a refractive index of 1.55 or lower. An electronic component according to preferred embodiments of the present disclosure is produced by using the photosensitive insulating paste.

Photosensitive insulating paste and electronic component

An inductor component includes an element body including insulating layers laminated on one another, and a coil conductor layer winding on a main surface of one of the insulating layers. The coil conductor layer contains sulfur.

A multilayer inductor component includes an element body that is an insulator and a coil in which a plurality of coil conductor layers that extend along planes in the element body are electrically connected to each other. Also, each of the coil conductor layers includes metal part and glass part, and the glass part include internal glass portion that is entirely included in the metal part.

Multilayer inductor component and method for manufacturing multilayer inductor component

A photosensitive conductive paste that contains (a) a conductive powder in an amount of 70.3 to 85.6 mass % with respect to the total amount of the photosensitive conductive paste; (b) a photosensitive resin composition containing an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, and a solvent; and (c) a glass frit. The mass ratio of the glass frit to the conductive powder is 0.020 to 0.054, and the glass frit has a softening point that is equal to or above the temperature at which sintering of the conductive powder starts.

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