Canon Kabushiki Kaisha

Kenta Furusawa

Shuji Koyama

Keisuke Kishimoto

Keiji Matsumoto

Taichi Yonemoto

Hiroyuki Abo

Kenji Fujii

Kazuhiro Asai

Jun Yamamuro

Sakai Yokoyama

Ryotaro Murakami

Tetsuro Honda

Hirohisa Fujita

Kouji Sasaki

A method for processing a silicon wafer is provided. The method includes allowing an etchant to flow along a surface of the silicon wafer to form a line in which a plurality of apertures are arranged in a flow direction of the etchant from an upstream side to a downstream side. The apertures arranged in the line include a first aperture formed on the most upstream side and a second aperture formed downstream of the first aperture in the flow direction of the etchant. The first aperture and the second aperture are subjected to different processes after being formed.

Method for processing silicon wafer

A method for producing a liquid-discharge-head substrate includes a step of preparing a silicon substrate including, at a front-surface side of the silicon substrate, an energy generating element; a step of forming a first etchant introduction hole on the front-surface side of the silicon substrate; a step of supplying a first etchant into the first etchant introduction hole formed on the front-surface side of the silicon substrate, and supplying a second etchant to a back-surface side of the silicon substrate; a step of stopping the supply of the second etchant; and a step of, after the supply of the second etchant has been stopped, forming a liquid supply port extending through front and back surfaces of the silicon substrate by the supply of the first etchant.

Method for producing liquid-discharge-head substrate

Provided is a processing method for an ink jet head substrate, including: forming a barrier layer on a substrate and forming a seed layer on the barrier layer; forming a resist film on the seed layer and patterning the resist film so that the patterned resist film corresponds to a pad portion for electrically connecting an ink jet head to an outside of the ink jet head; forming the pad portion in an opening of the patterned resist film; removing the resist film; subjecting the substrate to anisotropic etching to form an ink supply port; removing the barrier layer and the seed layer; and performing laser processing from a surface of the substrate.

Processing method for an ink jet head substrate

A substrate for a liquid ejection head, including: forming a sacrifice layer on a first surface of a silicon substrate in a region in which a liquid supply port is to open, the sacrifice layer containing aluminum which is selectively etched with respect to the silicon substrate; forming an etching mask on a second surface which is a rear surface of the first surface of the silicon substrate, the etching mask having an opening corresponding to the sacrifice layer; a first etching step of etching the silicon substrate by using the etching mask as a mask and by using a first etchant containing 8 mass % or more and less than 15 mass % of tetramethylammonium hydroxide; and after the first etching step, a second etching step of removing the sacrifice layer by using a second etchant containing 15 mass % or more and 25 mass % or less of tetramethylammonium hydroxide.

Method of producing substrate for liquid ejection head

A liquid composition used to carry out crystal anisotropic etching of a silicon substrate provided with an etching mask formed of a silicon oxide film with the silicon oxide film used as a mask includes cesium hydroxide, an alkaline organic compound, and water.

Liquid composition, method of producing silicon substrate, and method of producing liquid discharge head substrate

The present invention is a method of manufacturing a liquid discharge head, which includes providing a substrate on which a solid member is disposed to surround a region that becomes the flow path, and a metal layer made of a metal or a metal compound is disposed inside of the region, forming a mold made of a metal or a metal compound inside of the region, disposing a cover layer made of a resin to cover the solid member and the mold in contact with the solid member and the mold wherein the solid member and the metal are formed with a distance therebetween, and removing the mold to form the flow path.

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Yokohama, Japan

Kenta Furusawa