Mitsubishi Electric Corporation

Kenta Fujii

Masaki Kato

Yuji Shirakata

Takashi Kumagai

Tomohito Fukuda

Hidetoshi Ikeda

Toshiaki Kashihara

Koji Nakajima

Shota Sato

Masahiro Ueno

Tomoaki Shimano

Masaki Seguchi

Jun Tahara

Kyohei Ishikawa

Hiroyuki Yahara

Motoaki Nishiwaki

Hiroyuki Kiyonaga

Nobuaki Tanaka

Teruo Miyamoto

Satoshi Ishibashi

Yoshikazu Tsunoda

Yoshihiro Takeshima

Katsushi Nakada

Teruaki Fukuoka

Tsuneo Hamaguchi

Hideyuki Masui

Yujiro Nakada

Naoya Abe

Shuji Wakaiki

Kazuaki Fukui

Yukiko Nakanishi

Yuta Yoshimi

Shoichiro Nishizawa

Koshin Uomoto

A circuit device includes: a first heat sink having a first upper surface; a plurality of first partition plates and second partition plates attached to the first upper surface; a sealing material; a first circuit component; and a printed wiring board. A normal direction of the first upper surface is along a first direction. The first partition plates extend in a second direction orthogonal to the first direction. The second partition plates extend in a third direction orthogonal to the first direction and the second direction. The sealing material is made to fill a space defined by two adjacent first partition plates, two adjacent second partition plates, and the first upper surface. The first circuit component is disposed in the sealing material. The printed wiring board is disposed on the first partition plate and the second partition plate, and is electrically connected to the first circuit component.

Circuit device

A laminated coil includes planar coils and a first insulating member. The planar coils are arranged in a first direction intersecting a first surface. The first insulating member is in a film form and arranged between a pair of planar coils adjacent to each other in the first direction. At least one of the planar coils is wound to have a plurality of turns spaced apart from each other in a second direction along the first surface. A second insulating member is arranged between the turns adjacent to each other in the second direction of at least one of the planar coils.

Laminated coil, coil device, and power conversion device

Provided is a power conversion device with which a region in which an electronic component is mountable in a first printed wiring board of a first substrate can be enlarged. The power conversion device includes a power module installing member, a power module, a bus bar assembly, a first substrate provided on the bus bar assembly, and a second substrate provided on the bus bar assembly. The first substrate includes a first printed wiring board, and a signal terminal connector and a first board-to-board connection connector which are each provided on the first printed wiring board. The second substrate includes a second printed wiring board and a second board-to-board connection connector provided on the second printed wiring board. The signal terminal connector is connected to a signal terminal of the power module. The first board-to-board connection connector and the second board-to-board connection connector are connected to each other.

Power conversion device including substrates with connectors

A power conversion device includes an electronic component, a first printed board, a first cooling body, a second printed board, a second cooling body, a third printed board, and a third cooling body. The second cooling body extends from a second principal surface toward a first principal surface of the first printed board. The third cooling body extends from a second principal surface toward the first principal surface of the first printed board.

Power conversion device

A power conversion device includes an electronic component, a first printed circuit board, a first cooling body, a second printed circuit board, a second cooling body, and a first wiring member. The power conversion device further includes a first insulating member. On a first main surface of the first printed circuit board, a first joint portion to which the first wiring member is joined is provided. Between a second main surface of the first printed circuit board and the first cooling body, the first insulating member is arranged on a rear surface of at least the first joint portion.

In a coil device of a power conversion device, a laminated coil includes planar coils laminated on a surface of a support. A plurality of cores are spaced apart from each other and aligned in a longitudinal direction of the planar coils, and each core includes a portion around which the laminated coil is wound on the surface of the support. A first protruding member (is arranged between a pair of cores adjacent to each other with respect to a longitudinal direction and is fixed to the support. A first fixing member is arranged above the first protruding member. The laminated coil is sandwiched and fixed between the first fixing member and the first protruding member such that a first surface is in contact with the first protruding member and a second surface is in contact with the first fixing member.

A laser processing apparatus includes a laser oscillator; a processing head; a driver that controls a relative positional relationship between a workpiece and the processing head; control circuitry that controls the laser oscillator and the driver in order for the laser beam to scan a processing path on the workpiece; detection circuitry that observes a state of the workpiece being processed and outputs a result of observation as a time series signal; processed state observation circuitry that obtains evaluation information including a determination result that indicates whether a processed state of the workpiece is satisfactory or defective by evaluating the processed state of the workpiece on the basis of the time series signal for each of a plurality of sections obtained by dividing the processing path; and estimation circuitry that estimates a cause of a defect on the basis of the evaluation information of two or more of the sections.

Laser processing apparatus

A machining condition search device according to the disclosure includes a machining condition generation unit, a practical machining command unit, a machining evaluation unit, a prediction unit, an optimum machining condition calculation unit. The machining condition generation unit generates a machining condition defined by one or more control parameters settable on a machining apparatus. The practical machining command unit causes the machining apparatus to perform machining based on a generated machining condition. The machining evaluation unit generates an evaluation value of performed machining, on the basis of information indicating a machining result of the performed machining. The prediction unit predicts an evaluation value corresponding to a machining condition under which machining is not performed, on the basis of the evaluation value and the machining condition corresponding to the evaluation value. The optimum machining condition calculation unit obtains an optimum machining condition on the basis of a prediction value predicted by the prediction unit and an evaluation value generated by the machining evaluation unit. The optimum machining condition is a machining condition under which an evaluation value is equal to or greater than a threshold and a tolerance is maximum.

Machining condition search device and machining condition search method

To provide a power converter and a breaking mechanism which can break a DC current and can suppress that a fused material scatter to other circuits at fusing, in the case where the breaking mechanism of excess current is formed by a circuit pattern of a circuit board. In a power converter, a supporting member is provided with a support body part; a fixation projection part which projected from the support body part and to which the multilayer circuit board was fixed; and a support projection part which projected from the support body part and supports an one side circuit board face, wherein the fuse pattern is provided in an inner layer, and the support projection part overlaps with at least one part of a fusing part of the fuse pattern, viewing in a normal direction of the circuit board face of the multilayer circuit board.

Power converter and breaking mechanism

The present invention relates to a semiconductor device including a printed circuit board, an electronic component, and a heat diffusion part. The printed circuit board includes an insulation layer, first and second conductor layers disposed respectively on first and second main faces of the insulation layer, a plurality of heat radiation vias penetrating from the first conductor layer to the second conductor layer on the insulation layer, and a conductor film covering inner side walls of the heat radiation vias. The heat radiation vias are provided at positions overlapping the electronic component and the heat radiation part in plan view viewed from the first main face of the printed circuit board. The heat diffusion part is disposed overlapping at least some of the heat radiation vias in plan view viewed from the second main face of the printed circuit board.

Semiconductor device

There is provided an electric-power conversion apparatus in which smoke emission, a burnout, and short-circuiting between a melted material and a peripheral member can be suppressed even when a fuse portion is melted by an excessive current. An electric-power conversion apparatus includes an electric power semiconductor device, an electrode wiring member, a case, a fuse portion formed in the electrode wiring member, a fuse resin member disposed between the fuse portion and the case, and a sealing resin member that seals the electric power semiconductor device, the electrode wiring member, the fuse portion, and the fuse resin member in the case.

Electric-power conversion apparatus

A circuit device capable of significantly improving heat dissipation performance of a printed circuit board without increasing the size includes a printed circuit board, a mounted component, a non-solid metal spacer, a cooler, and a resin layer. The mounted component is at least partially disposed on at least one main surface of printed circuit board. The non-solid metal spacer is disposed at least on one main surface of the printed circuit board. The cooler is disposed at the non-solid metal spacer on the opposite side to the printed circuit board. The resin layer is disposed between the non-solid metal spacer and the cooler. The non-solid metal spacer has a shape that allows at least one hollow portion to be formed between the printed circuit board and the cooler.

Circuit device and power conversion device

An isolated converter reduced in size compared with a conventional isolated converter and having a high heat dissipation characteristic is provided. The isolated converter includes a multilayer substrate having a first through hole and a magnetic core partially passing through the first through hole. The multilayer substrate includes a first conductor pattern formed at a position overlapping the magnetic core on a second surface when viewed from a direction orthogonal to a first surface, a second conductor pattern formed between the first surface and the second surface at a position overlapping the magnetic core and the first conductor pattern when viewed from the direction orthogonal to the first surface, at least one thermal conductive member formed on the first conductor pattern and having a portion disposed between the multilayer substrate and the magnetic core, and an electric insulating layer electrically insulating the first conductor pattern from the second conductor pattern.

Isolated converter

A circuit device and a power converter include a core, a coil surrounding at least a part of the core, and a first heat transfer member being in surface contact with the core. A temperature rise of the core can thus be prevented or reduced.

Circuit device and power converter

There is provided an electric-power conversion apparatus in which smoke emission, a burnout, and short-circuiting can be suppressed even when a fuse portion is melted by an excessive current and in which it is made possible that heat generated in the fuse portion is less likely to be transferred to the electric power semiconductor device. The electric-power conversion apparatus includes a fuse portion formed in an electrode wiring member, a fuse resin member that covers the fuse portion, and a sealing resin member that seals an electric power semiconductor device and the fuse portion in a case. Along a current-flowing direction, the fuse portion includes an upstream-side first step portion whose cross-sectional area is smaller than that of the portion at the upstream side thereof, a second step portion whose cross-sectional area is smaller than that of the upstream-side first step portion, and a downstream-side first step portion whose cross-sectional area is larger than that of the second step portion but is smaller than that of the portion at the downstream side thereof.

Growing community of inventors

Tokyo, Japan

Kenta Fujii