Motorola Corporation

Kent W Hansen

Michael S Lebby

Earl K Davis

Christopher K Chun

Shun-Meen Kuo

Davis H Hartman

Hang M Liaw

Dennis Brian Miller

Frank S d'Aragona

William M Beckenbaugh

Daniel Joseph Viza

Robert M Wentworth

Ravinder K Sharma

Scot W Taylor

Duane C Silvis

Conrad S Monroe

A microelectronic assembly (10) is formed by bonding an integrated circuit component (20) to a substrate (12). The substrate (12) includes a via (22) and a metal contact (24) closing the via (22). A bonding agent (14), such as a solder paste or a conductive epoxy, is dispensed into the via (22) adjacent the metal contact (24). A carrier tape (16) that includes partially-cured films (18) is placed onto the substrate (12) such that the film (18) covers the via (22) and forms a gap (28) between the substrate (12) and the film (18). The integrated circuit component (20) is superposed onto the substrate (12) such that conductive bumps (26) on the integrated circuit component (20) perforate and extend through the film (18) and contact the bonding agent (14) in the via (22). Portions (44) displaced during perforation are received in the gap (28). The film (18) is thus interposed between the substrate (12) and the integrated circuit component (20). The preassembly (38) is then heated to bond the bonding agent (14) to the metal contact (24) and to cure the film (18) to form an integral assembly (10).

Method for forming a microelectronic assembly

An electrically conductive waveguide is provided. A waveguide including a core region, a cladding region, a first surface and an end surface is fabricated. Cladding region covers a portion of the core region forming the first surface, and a portion of the core region and the cladding region form the end surface. The first surface and the end surface meet to form a nexus. An opening located at the nexus of the first surface and the end surface is formed with a conductive member located in the opening.

Waveguide with an electrically conductive channel

A flexible circuit film (103) having a plurality of electrical tracings (118) is provided. A mold (102) having a cavity (112) capable of accepting the flexible circuit film (103) is provided. The flexible circuit film (103) is placed into the mold (102). A first optical portion (203) is molded with the flexible circuit film (103) in the cavity (112) of the mold (102) so as to join the flexible circuit film (103) to the first optical portion (203).

Optoelectronic interface module

Method of making an optoelectronic interface module

A method and product for monocrystalline semiconductor buried layer contacts formed from recrystallized polycrystalline buried layers.

Monocrystalline semiconductor buried layers for electrical contacts to

An inexpensive glass capacitive pressure sensor. Conductive capacitor electrodes are disposed on two flat glass plates, one serving as a diaphragm, the other as a substrate. The electrodes are positioned in a spaced apart, substantially parallel relationship to form the plates of a parallel plate capacitor. The glass plates are sealed together with a sealing glass mixture to bound a volume between the conductors. The volume is at a reference pressure, preferably a substantial vacuum. Differences between the pressure to be measured and this reference pressure cause a flexing of the glass diaphragm which is detected by measuring the capacitance between the two electrodes. A suitable sealing glass mixture which provides a hermetic seal between the glass plates is comprised of, in weight percent, 8-10 SiO.sub.2, 1-2 Al.sub.2 O.sub.3, 55-60 PbO, 7-9 PbF.sub.2, 7-10 ZnO, 4-6 CdO, and 10-15 B.sub.2 O.sub.3. The sealing glass mixture must be vacuum fined to permit hermetic sealing within a vacuum.

Capacitive pressure sensor and method of making it

A solder glass/ceramic composition and method for sealing television picture tube components wherein the composition remains vitreous throughout the sealing process. The composition comprises a mixture of 9-15 weight percent aluminum oxide and 91-85 weight percent solder glass. The solder glass components comprise, in weight percent of the glass alone, SiO.sub.2 about 2-4 percent, PbO about 64-66 percent, PbF.sub.2 about 5-10 percent, ZnO about 6-9 percent, CdO about 4-6 percent, and B.sub.2 O.sub.3 about 12-14 percent.

Sealing glass compositions and method

A method for sealing two ceramic pieces, a lead frame and a semiconductor chip together involving the application of pressure to a layer of sealing glass composition which remains vitreous throughout the sealing process is disclosed. The sealing glass composition comprises a mixture of sealing glass and zirconium silicate in the volume percentage amounts of 50-62 percent of glass and 50-38 percent of zirconium silicate. The glass components comprise, as a percentage weight of the glass alone, SiO.sub.2 about 0-2 percent, PbO about 65-72 percent, ZnO about 5-10 percent, PbF.sub.2 about 2-10 percent, CdO about 1-5 percent, TiO.sub.2 about 0.5-3 percent and B.sub.2 O.sub.3 about 10-14 percent.

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Scottsdale, AZ, United States of America

Kent W Hansen