Texas Instruments Corporation

Kent R Carson

William R McKee

Jules D Levine

Joseph D Luttmer

Charles E Williams

Elwin L Johnson

Charles M Hess

Stephen T Tso

The disclosure relates to a photovoltaic solar array which is provided with a matrix having spherical photovoltaic diode particles embedded therein in an ordered array, the P-type region of each particle extending to one matrix surface and the N-type region of each particle extending to an opposed matrix surface. Backside metallization is disposed on the matrix backside surface to interconnect the particles extending thereto and frontside conductors are provided on the opposing matrix surface to interconnect the particles extending thereto. The matrix includes two portions, the first portion being a layer extending to the frontside formed of a clear glass. The second portion of the matrix is, in effect, two layers, one disposed at the P-N junctions of the particles being a lead base glass for junction passivation, this layer being overcoated with a reflective layer to provide additional reflectivity of light entering the matrix onto the particles. This increases the amount of light impinging on the particles. The frontside of the matrix includes a light transparent conductive material with electrically conductive whiskers embedded therein for improved conductivity.

Photovoltaic solar arrays using silicon microparticles

Polycrystalline semiconductor material is treated to form a skin of a thermally stable substance and melted with the molten material retained by the film. Upon cooling, the material solidifies as single crystal and the skin is removed.

Production of single crystal semiconductors

Disclosed is a semiconductor device package for a multielement electro-optical device. The package includes a base structure, a cover and an environmental seal. The cover is secured with screws to the base structure and sealed at this interface to provide an environmentally protected package. The base structure includes a base member and a fine geometry lead pattern substrate loosely attached to the base member internal to the package. Connector pins are mounted either in retainer blocks or in the substrate attached to the base. The multielement electro-optical device is mounted upon a support member and its elements electrically coupled to leads to provide for testing prior to incorporation into the package. The device and support member or members constitute a subassembly which is electrically coupled to the lead pattern of the package substrate. The package substrate may be a single substrate loosely mounted on the base member to provide a substantially stress-free package or a segmented substrate of which each segment is loosely attached to the base plate to provide even a more substantially stress-free package.

Package for multielement electro-optical devices

Growing community of inventors

McKinney, TX, United States of America

Kent R Carson