Molex Corporation

Other

Grayhill, Inc.

Molex Incorporation

Molex Incorproated

Molex Incoporated

Molex Incporporated

Kent E Regnier

Patrick R Casher

Harold Keith Lang

Emanuel G Banakis

Bruce Reed

Darian Ross Schulz

Jerry A Long

Brian Keith Lloyd

Michael J Rowlands

Brandon Janowiak

Gregory B Walz

Ayman Isaac

Gregory R Pratt

Jay H Neer

David L Brunker

Hazelton P Avery

Javier Resendez

Jerry D Kachlic

Michael Rost

Munawar Ahmad

Gregory Fitzgerald

Eran J Jones

Steven George Sutter

John C Laurx

David E Dunham

Alan S Walse

Michael R Kamarauskas

Robert A Owsley

Brian P O'Malley

Jennifer Swenson

Frank A Harwath

Johnny C Chen

Victor V Zaderej

Kirk B Peloza

Richard A Nelson

Timothy R McClelland

Anthony M DiViesti

Philip J Dambach

Peerouz Amleshi

Cleaver Brinkerhoff

Michael F Magajne

John M Stipanuk

Kathleen A Sweeney

Dennis K Scheer

Keith Lloyd

Shoji Yamada

Masanori Yagi

Scott D Sommers

Galen F Fromm

Yew Teck Yap

Ed Seamands

Kenneth M Stiles

Patrick D Bakke

Martin Uche Ogbuokiri

Vladimir A Dashevsky

Donald D Kikta

Paul Bowling

Daniel B McGowan

Michael O'Sullivan

Daniel L Dawiedczyk

Craig A Bixler

Marko Spiegel

Kenneth W Stanevich

David Schmidgall

William H Darden

David Brearley, Jr

Stacey E Caldwell

Daniel Thomas Klein

John Jantelezio

Thomas C Hoover

Thomas Hall

Emmanuel G Banakis

Kevin Alberts

Blaine C Woting

A receptacle is depicted. The receptacle can provide two rows of terminals to increase the density of the interface. If desired, a connector positioned in the receptacle can omit the use of a housing, even if the receptacle provides a stacked connector configuration. With the use of various airflow features it is possible to cool inserted plug modules that use more than 6 watts and potentially more than 8 watts of power.

High density receptacle

A connector system for a pluggable IO connector is disclosed that includes a plug with two rows of pads on two sides of a mating blade and a receptacle with two connection regions that is configured to engage the two rows of pads. In an embodiment the connector system can support double the data bandwidth of a typical connector, such as a QSFP connector, while allowing for backward compatibility with convention plug assemblies that have a single row of pads on each side the mating blade.

Plug assembly and receptacle assembly with two rows

A routing assembly for an electronic device has a plurality of connectors ports and each of the connector ports contains a first connector connected to one or more cables. Cables are directly terminated, at first ends thereof, to terminals of the first connectors and the cables can be embedded in a routing substrate. The routing substrate has an opening which accommodates a chip package. Second ends of the cables are terminated to second connectors arranged in the package opening and the second connectors are in turn connected to the chip package.

Integrated routing assembly and system using same

A connector for use in a free-standing connector port for mating with an external pluggable module is disclosed. The connector has terminals that extend lengthwise of the connector so that cables may be terminated to the terminals and the terminals and cable generally are horizontally aligned together. The connector defines a card-receiving slot and is position in a cage that defines the connector port. The cables exit from the rear of the connector and from the connector port. The connector includes a heat sink that is configured to cool a module inserted into the connector port.

Circuit board bypass assemblies and components therefor

A connector system includes a plug assembly that has a front connector mounted to a circuit board. The connecter has two wafers that each support a row of terminals and uses shims and pegs to precisely control the spatial relationship of the two wafers to the circuit board. The wafers need not be directly contacting the circuit board and the terminals can have tails that can be positioned slightly above the circuit board and connector to pads on the circuit board via solder connections. The connector system is optimized so as to enable support of 25 Gbps data rates.

Compact high speed connector

A connector includes a heat spreader. The heat spreader is configured to direct heat from ports to a thermal plate that is spaced apart from the connector. A plurality of connectors can be supported and a heat spreader can be associated with each connector. One or more thermal plates can be thermally coupled to the corresponding heat spreader(s) so as to direct thermal energy away from each connector. Cold blocks can be used to thermally couple the heat spreader to the corresponding thermal plates.

Connector system with thermal cooling

A routing assembly for an electronic device has a plurality of connectors ports and each of the connector ports contains a first connector connected to one or more cables. Cables are directly terminated, at first ends thereof, to terminals of the first connectors and the cables can be embedded in a routing substrate. The routing substrate has an opening which accommodates a chip package. Second ends of the cables are terminated to second connectors arranged in the package opening and the second connectors are in turn connected to third connectors that are connected to the chip package.

A connector for use in a free-standing connector port for mating with an external pluggable module is disclosed. The connector has terminals that extend lengthwise of the connector so that cables may be terminated to the terminals and the terminals and cable generally are horizontally aligned together. The connector defines a card-receiving slot and is position in a cage that defines the connector port. The cables exit from the rear of the connector and from the connector port.

A connector system with improved thermal management is provided. Various receptacles are provided that include features which may enhance air flow, and therefore cooling. Thermal channel features in the receptacle cage and/or housing allow air passing through the receptacle to directly remove thermal energy from components within and carry the thermal energy out of the cage.

Thermally configured connector system

A connector is provided that includes a plurality of wafers. Each wafer supports a terminal and adjacent signal wafers are configured so as to provide broad-side coupled terminals. A pair of signal terminals can be surrounded on both sides by ground wafers that offer shielding so as to help isolate one signal pair from another signal pair. The geometry of the wafers can be adjusted so as to provide a tuned transmission channel. The resultant tuned transmission channel can be configured to provide desirable performance at high signaling frequencies of 12-16 GHz or even higher signaling frequencies such as 20 GHz.

Connector with tuned channel

A plug module is provided that includes a first mating end and a second mating end. The first mating end is configured to mate with a predefined port, such as a QSFP port. The second mating end can support two or more micro receptacles that allow the plug module to provide an octopus-like cable assembly without requiring the predetermination of a particular length of cable.

Plug module system

A receptacle includes a cooling channel that is positioned between a top port and a bottom port. A transfer member is positioned in the cooling channel and is configured to direct heat from an inserted plug module into the cooling channel Air flowing through the cooling channel acts to remove thermal energy from the receptacle. A connector system may include a plug module that can be inserted into such a receptacle and the plug module can include grooves to help allow for direct cooling of the plug module, even when inserted into the receptacle.

Connector system with air flow and flanges

A connector assembly can be provided. A receptacle includes terminals that can be positioned in a card slot on a 0.60 mm pitch (or greater). A biasing element can be provided in the card slot to engage a mating paddle card. The receptacle can be configured to allow air to flow from a front face to a rear face, the air passing through a middle wall. A plug assembly can be provided that includes a conductive body and is configured to generate some amount of heat. The body can include a surface that has cooling grooves. The cooling grooves allow air flow over the plug assembly so that the plug assembly can be cooled directly.

Thermally efficient connector system

Growing community of inventors

Lombard, IL, United States of America

Kent E Regnier