Nichia Corporation

Kensuke Yamaoka

Hiroki Nakai

Daisuke Sanga

Kenji Ozeki

Dai Wakamatsu

Kimihiro Miyamoto

Yoshiyuki Ide

Masaki Nagao

Hiroaki Kuroda

A light-emitting module includes: a plurality of light-emitting elements; a first substrate having an upper surface that includes an element mounting region on which the light-emitting elements are mounted, the first substrate including a plurality of first terminals; a second substrate having an upper surface that includes a substrate mounting region on which the first substrate is mounted, the second substrate including a plurality of second terminals; a plurality of wires each connected to corresponding ones of the first terminals and the second terminals; a light-shielding covering member disposed outward of the element mounting region so as to cover the plurality of wires; and a light-transmissive first projection disposed along the element mounting region between the element mounting region and the first terminals so as to be in contact with the covering member.

Light-emitting module and method of manufacturing light-emitting module

A light-emitting module includes a first wiring board, a plurality of light-emitting elements disposed on or above the first wiring board, a first light-transmissive layer covering the plurality of light-emitting elements, a spacer disposed on or above the first light-transmissive layer, and a second light-transmissive layer disposed on or above the spacer. An air layer is present between the first light-transmissive layer and the second light-transmissive layer. The spacer does not overlap with at least one of the plurality of light-emitting elements in a plan view.

Light-emitting module with spacer

A method for manufacturing a light emitting module includes: providing an intermediate body including: a wiring substrate including a metal layer, a first conductive member, and a second conductive member; disposing a resist layer on the intermediate body; disposing a light-emitting element on the resist layer, the light-emitting element comprising: a first electrode, and a second electrode; forming on the metal layer: a first bonding member in contact with the first conductive member and the first electrode, and a second bonding member separated from the first conductive member and in contact with the second conductive member and the second electrode; and removing the resist layer.

Light emitting module and method for manufacturing light emitting module

An optical member includes a first light guide member having an elongated shape and comprising an end surface and a lateral surface extending in a longitudinal direction from the end surface; and a wavelength conversion layer disposed on the lateral surface of the first light guide member and containing a phosphor.

Optical member, composite optical member, and lighting device

A light emitting device includes: a first substrate including: a first lead, and a second lead positioned apart from the first lead; a second substrate disposed on an upper face of the second lead, the second substrate including: a base, and a first conducting part disposed on an upper face of the base; a light emitting element disposed on the second substrate and electrically connected to the first conducting part; a first wire electrically connecting the first lead and the first conducting part; and a wall part straddling and covering an upper face of the first lead and an upper face of the second lead. A height of the wall part is less than a height of the second substrate.

Light emitting device

A light-emitting device includes: a mounting board; a light-emitting element disposed on or above the mounting board; a plate-shaped light-transmissive member having: a first surface; and a second surface facing a light-emitting surface of the light-emitting element; a light-reflective member covering a lateral surface of the light-transmissive member; and a light-shielding frame on an upper surface of the light-reflective member around the light-transmissive member. The light-shielding frame has an opening. An inner perimeter of the opening is located apart from outer perimeters of the first surface and the second surface of the light-transmissive member in a top plan view. The light-reflective member is disposed between the inner perimeter of the opening and the outer perimeters of the light-transmissive member.

Light-emitting device including light-transmissive member, light -reflective member, and light-shielding frame

A method of manufacturing a light emitting device includes: mounting a light emitting element on a substrate; disposing a light shielding frame on a sheet, the light shielding frame having an opening; disposing a plate-shaped light transmissive member in the opening, the plate-shaped light transmissive member having a first face and a second face opposite the first face, wherein an outer perimeter of the first face is smaller than an inner perimeter of the opening; forming a light guide support member by filling the space with a first light reflecting member; bonding the light guide support member by bonding an upper face of the light emitting element and the second face of the light transmissive member; and forming a second light reflecting member surrounding the light emitting element by filling the space between the substrate and the light shielding frame with a second reflecting resin.

Method of manufacturing light emitting device

A method of manufacturing a light-emitting device includes: mounting a light-emitting element on a mounting board; placing a light-shielding frame on a sheet, the light-shielding frame defining an opening and comprising at least one narrow portion having a width that is smaller than that of another portion of the light-shielding frame in a top view; applying a light-reflective resin on at least the narrow portion of the light-shielding frame; forming a light-guiding supporting member; and bonding the second surface of a light-transmissive member of the light-guiding supporting member to an upper surface of the light-emitting element so as to fix the light-guiding supporting member on or above the light-emitting element.

Method of manufacturing light-emitting device

A light emitting device manufacturing method includes: disposing n pieces of light emitting elements in m rows on a substrate block, where an interval between a kth light emitting element from one end of rows and a (k+1)th light emitting element has a first distance; disposing a phosphor member on the light emitting elements; disposing a frame member to surround the light emitting elements; disposing a cover member in each area surrounded by the frame member to cover lateral surfaces of the light emitting elements and the phosphor members while forming recesses at an upper surface between the kth light emitting elements and the (k+1)th light emitting elements apart by the first distance; disposing a light shielding member in each recess; and cutting the light shielding members, the cover members, and the substrate block between the light emitting elements that are apart by the first distance.

Light emitting device having light shielding member formed in recess of cover member and method for manufacturing the same

A method for manufacturing a light-emitting device includes: a mounting step; a light-shielding frame placement step; a light-transmissive member placement step; a light-guiding supporting member formation step; a light-guiding supporting member bonding step; and a second light-reflective member formation step.

Light-emitting device and method for manufacturing the same

A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, first external connecting parts and at least one second external connecting part. The semiconductor layered body includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The first electrode is connected to the first semiconductor layer at exposed parts through openings in the insulating film, and partially arranged on the second semiconductor layer via the insulating film. The first external connecting parts are connected to the first electrode. The first external connecting parts are spaced apart from the exposed parts in a plan view, and at least two of the first external connecting parts being arranged between at least one set of adjacent ones of the exposed parts in the plan view. The second external connecting part is connected to the second electrode.

Light emitting element and light emitting device

A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a light transmissive member having a plate shape and having an upper face and a lower face that is larger than the upper face, disposed such that the lower face opposes a light emission face of the light emitting element; a light reflecting member covering lateral faces of the light transmissive member; and a light shielding frame covering lateral faces of the light transmissive member via the light reflecting member. The light shielding frame has an opening. An outer perimeter of the lower face of the light transmissive member is positioned outward of an inner perimeter of the opening in a plan view as seen from above.

Light emitting device and method of manufacturing same

A semiconductor device manufacturing method includes: (A) orienting an upper surface of a semiconductor element which has the upper surface and a suction surface of a collet which has a suction hole so that the upper surface of the semiconductor device and the suction surface of the collet face each other, the upper surface including a first region and a second region, the second region lying higher than the first region; (B) bringing the suction surface of the collet into contact with a part of the second region of the semiconductor element; and (C) picking up the semiconductor element using the collet while the collet sucks in air between the first region and the suction surface via the suction hole, wherein in (B), an entirety of an uppermost surface of the second region is in contact with a region of the suction surface exclusive of the suction hole.

Method for manufacturing semiconductor device

A light emitting device includes: a substrate; a light emitting element disposed on the substrate; a light transmissive member having a plate shape and having an upper face and a lower face disposed such that the lower face opposes a light emission face of the light emitting element; a light reflecting member covering lateral faces of the light emitting element and lateral faces of the light transmissive member; and a light shielding frame disposed on the upper face of the light reflecting member surrounding the light transmissive member. The light shielding frame has an opening, an inner perimeter of the opening is positioned at a distance apart from an outer perimeter of the upper face of the light transmissive member in a plan view as seen from above, and the light reflecting member is interposed between the inner perimeter of the opening and the outer perimeter of the upper face of the light transmissive member.

A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, first external connecting parts and at least one second external connecting part. The semiconductor layered body includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer. The first electrode is connected to the first semiconductor layer at exposed parts through openings in the insulating film, and partially arranged on the second semiconductor layer via the insulating film. The first external connecting parts are connected to the first electrode. The first external connecting parts are spaced apart from the exposed parts in a plan view. A group comprising at least one of the first external connecting parts and other group comprising at least one of the first external connecting parts respectively surround adjacent ones of the exposed parts while being spaced apart from each other in the plan view.

Growing community of inventors

Tokushima, Japan

Kensuke Yamaoka