Other

Elpida Memory, Inc.

Nec Corporation

Renesas Eastern Japan Semiconductor, Inc.

Kensuke Tsuneda

Seiichiro Tsukui

Toshio Sugano

Hiroshi Ikeda

Mitsuaki Katagiri

Hideaki Takahashi

Tatsuya Nagata

Tomohiko Sato

Hiroya Shimizu

Masaharu Imazato

Kouji Nagaoka

In a memory module, reference potential connecting patterns are disposed on high frequency signal lines and/or on the extension lines extending from the terminal ends of the signal lines as well as a shield cover for covering semiconductor memory chips is disposed on the substrate, and the reference potential connecting patterns are connected to the shield cover through metal cover contact parts.

Semiconductor device, noise reduction method, and shield cover

To arrange semiconductor parts such as chip resistors and the like between a BGA and a mounting substrate, an interposes is disposed between the BGA and the mounting substrate for mounting the BGA thereon. The interposer serves to maintain the distance between the mounting substrate and the BGA to be just as large as or larger than the thickness of the semiconductor parts and to electrically connect solder balls of the BGA and electrically conductive patterns of the mounting substrate. The semiconductor parts are mounted on the mounting substrate before fixing the BGAto the interposer.

Mounting structure for semiconductor parts and semiconductor device

A memory module MM, in which a module wiring substrate is equipped with function switching means KK and KK for arbitrarily switching function switching signals to be inputted to function switching pins FP and FP of memories . By these function switching means KK and KK , moreover, the function switching signals are arbitrarily switched from any of no connection, a supply voltage Vcc and a ground potential Vss. These signals are inputted altogether to all the mounted memories to switch and arbitrarily set functions including reading modes and refresh cycles.

Semiconductor device and process for manufacturing the same

A memory TCP loaded with four chips (1-bank 16-bit type) is constructed by a tape of one two-layer wiring layer structure, four chips mounted to this tape, etc. Common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side. The common signal terminals on the two sides are electrically connected to each other common signal wiring. Further, in a DIMM in which this memory TCP is mounted to front and rear sides of a substrate, plural external terminals are formed on one long side of the rectangular substrate, and the memory TCP is mounted such that the independent signal terminal of the memory TCP is arranged along an arranging direction of these external terminals.

Semiconductor device, a semiconductor module loaded with said semiconductor device and a method of manufacturing said semiconductor device

A memory module MM, in which a module wiring substrate,is equipped with function switching means KK,and KK,for arbitrarily switching function switching signals to be inputted to function switching pins FP,and FP,of memories,By these function switching means KK,and KK,moreover, the function switching signals are arbitrarily switched from any of no connection, a supply voltage Vcc and a ground potential Vss. These signals are inputted altogether to all the mounted memories,to switch and arbitrarily set functions including reading modes and refresh cycles.

A memory module MM, in which a module wiring substrate,is equipped with function switching means KK,and KK,for arbitrarily switching function switching signals to be inputted to function switching pins FP,and FP,of memories,. By these function switching means KK,and KK,, moreover, the function switching signals are arbitrarily switched from any of no connection, a supply voltage Vcc and a ground potential Vss. These signals are inputted altogether to all the mounted memories,to switch and arbitrarily set functions including reading modes and refresh cycles.

Growing community of inventors

Kokubunji, Japan

Kensuke Tsuneda