Japan Servo Co.,ltd.

Kensuke Shoji

Kenji Sugaya

Naotaka Sasaki

Shunichi Kawamata

Misao Ichikawa

A lamination system comprises a thermocompression bonding means for bonding laminate films on top and/or back surfaces of cards, applying heat and pressure using a pair of heat rollers. The lamination system is provided with contact type temperature detection devices for detecting surface temperatures of the heat rollers and a heat roller attaching/detaching device for attaching or detaching the heat rollers. The heat roller attaching/detaching device places the temperature detection devices in contact with surfaces of the heat rollers when the heat rollers are being installed in the lamination system, and places the temperature detection devices apart from the heat rollers when the heat rollers are to be attached to, or detached from, the lamination system.

Lamination system

In a lamination system for laminating a film with a heat adhesive layer on at least a surface of a plastic card applying heat and pressure by heat rollers, each of two rectification devices for rectifying warp in the laminated card is provided independently of each other, at the downstream of the heat rollers, respectively along each of sides of the card along card transfer direction. Each of the rectification devices comprises a pair of rotatable rollers.

A lamination system of the present invention comprises; a film transfer means for transferring a continuous film, a cutting means for cutting the film, a card transfer means for transferring an ID card, a thermocompression bonding means for laminating the film to the ID card, a card straightening means straightening the ID card bent during the thermocompression bonding, in which a spring up suppression means for suppressing a spring up of a trailing edge of the ID card leaving the thermocompression bonding means is provided.

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Kiryu, Japan

Kensuke Shoji