Screen Holdings Co., Ltd.

Kensuke Shinohara

Taiki Hinode

Sei Negoro

Toru Edo

Masahiro Tokuyama

A substrate processing condition setting method includes acquiring, causing, and setting. In the acquiring, a plurality of estimation processing results are acquired by inputting a plurality of processing conditions to a trained model that is subjected to machine training based on a training processing condition and a processing result obtained by processing a substrate under the training processing condition. In the causing, a display section is caused to display an image based on the estimation processing results. In the setting, one processing condition corresponding to one estimation processing result of the estimation processing results is set, as an actual processing condition in substrate processing, based on the image displayed on the display section.

Substrate processing condition setting method, substrate processing method, substrate processing condition setting system, and substrate processing system

In order to improve the quality of a substrate, a substrate processing apparatus includes a substrate holding unit, a first drive unit, a chemical liquid discharge portion, a cup unit, a second drive unit, and a control unit. The substrate holding unit holds a substrate having a first surface and a second surface opposite to the first surface in a horizontal posture. The first drive unit rotates the substrate holding unit about a virtual axis. The chemical liquid discharge portion discharges a chemical liquid toward the first surface of the substrate held by the substrate holding unit. The cup unit surrounds a periphery of the substrate holding unit. The second drive unit changes a relative position in the vertical direction of the cup unit with respect to the substrate holding unit. The control unit, while causing the first drive unit to rotate the substrate holding unit about the virtual axis and causing the chemical liquid discharge portion to discharge the chemical liquid toward the first surface of the substrate held by the substrate holding unit to execute a chemical liquid treatment of treating the first surface, causes the second drive unit to change the relative position in the vertical direction of the cup unit with respect to the substrate holding unit.

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Kyoto, Japan

Kensuke Shinohara