Mitsubishi Materials Electronic Chemicals Co., Ltd.

Mitsubishi Materials Corporation

Symetrix Corporation

Mitsubishi Materials Electronics Chemicals Co., Ltd.

Kensuke Kageyama

Takashi Konishi

Nobuyuki Soyama

Katsumi Ogi

Carlos Alberto Paz De Araujo

Larry D McMillan

Michael C Scott

Hiroto Uchida

Hirokazu Tsukada

Kazuhiko Yamasaki

Naoyuki Aiba

Joseph D Cuchiaro

Tadashi Yonezawa

Satoko Higano

Jeffrey W Bacon

Hiroto Akaike

Osamu Sakaya

Gary F Derbenuick

Tasuku Sugiura

Masaya Karube

Kei Kinoshita

Shigeki Ishikuro

Metal coated resin particles include: spherical core resin particles; and a metal coated layer provided on a surface of each of the core resin particles, in which the metal coated layer consists of: a first silver layer formed on the surface of each of the core resin particles; a tin intermediate layer consisting of one or more of metallic tin and/or tin compounds selected from the group consisting of tin (Sn), tin oxide (SnO), and tin hydroxide (Sn(OH)) formed on a surface of the first silver layer (where, 0.1<x<4, 0.1<y<5); and a second silver layer formed on a surface of the tin intermediate layer.

Metal coated resin particles, method for producing same, conductive paste containing metal coated resin particles, and conductive film

A black material of the present invention consists of a zirconium nitride powder containing yttrium. The amount of the yttrium is 1.0% by mass to 12.0% by mass with respect to a total 100% by mass of the zirconium nitride powder and the yttrium. In a transmission spectrum obtained from a dispersion in which the concentration of the zirconium nitride powder containing yttrium is 50 ppm, assuming that the light transmittance at a wavelength of 550 nm is denoted by X, and the light transmittance at a wavelength of 365 nm is denoted by X, Xis 7.5% or less, Xis 25% or more, and X/Xis 3.5 or more.

Black material and method for producing same, black photosensitive composition and method for producing same, and black patterning film and method for forming same

A zirconium nitride powder coated with alumina has a volume resistivity is 1×10Ω·cm or higher. Also, an coating amount with alumina is 1.5% by mass to 9% by mass with respect to 100% by mass of the zirconium nitride. Furthermore, an isoelectric point of the zirconium nitride powder coated with alumina is 5.7 or higher.

Zirconium nitride powder coated with alumina and process for producing the same

The present invention provides a powder for forming a black light-shielding film having a specific surface area of 20 to 90 m/g, which is measured by the BET method, comprising zirconium nitride as a main component, and containing magnesium and/or aluminum. If containing the magnesium, the content of the magnesium is 0.01 to 1.0% by mass relative to 100% by mass of the powder for forming a black light-shielding film, and if containing the aluminum, the content of the aluminum is 0.01 to 1.0% by mass relative to 100% by mass of the powder for forming the black light-shielding film.

Powder for forming black light-shielding film and method for manufacturing same

A zirconium nitride powder having a volume resistivity of 107 &#x3a9;&#xb7;cm or more in the state of the pressurized powder body hardened at a pressure of 5 MPa, and a particle size distribution D90 of 10 &#x3bc;m or less when ultrasonically dispersed for 5 minutes in a state of being diluted with water or an alcohol having a carbon number of which is in a range of 2 to 5. Also, the zirconium nitride powder is dispersed in an acrylic monomer or an epoxy monomer to prepare a monomer dispersion. Further, the zirconium nitride powder is dispersed in a dispersing medium as a black pigment and further a resin is mixed to prepare a black composition.

Zirconium nitride powder and method for producing same

A zirconium nitride powder which has a specific surface area of 20 to 90 m/g as measured by a BET method, has a peak corresponding to zirconium nitride but does not have a peak corresponding to zirconium dioxide, a peak for lower zirconium oxide or a peak corresponding to lower zirconium oxynitride in an X-ray diffraction profile, and the light transmittance X at 370 nm is at least 18%, the light transmittance Y at 550 nm is 12% or less and the ratio (X/Y) of the light transmittance X at 370 nm to the light transmittance Y at 550 nm is 2.5 or more in the transmission spectra of a dispersion that contains the powder at a concentration of 50 ppm.

A silver-coated resin particle having a resin particle and a silver coating layer provided on a surface of the resin particle, in which an average value of a 10% compressive elastic modulus is in a range of 500 MPa or more and 15,000 MPa or less and a variation coefficient of the 10% compressive elastic modulus is 30% or less.

Silver-coated resin particle

The present invention provides a zirconium nitride powder comprising zirconium, nitrogen, and oxygen as main components, wherein the zirconium concentration is 73 to 82% by mass, the nitrogen concentration is 7 to 12% by mass, and the oxygen concentration is 15% by mass or less; in the transmission spectra of a dispersion having a powder concentration of 50 ppm, a light transmittance X at 370 nm is at least 12% and a light transmittance Y at 550 nm is 12% or less; and the ratio (X/Y) of the light transmittance X at 370 nm to the light transmittance Y at 550 nm is at least 1.4.

Zirconium nitride powder and production method therefor

Provided is a black-film-forming mixed powder containing: (A) a zirconium nitride powder that does not contain zirconium dioxide, a low-order oxide of zirconium, or a low-order oxynitride of zirconium; and (B) a titanium nitride powder or a titanium oxynitride powder, wherein the content ratio of (A) the zirconium nitride powder and (B) the titanium nitride powder or the titanium oxynitride powder is within the range of 90:10 to 25:75 in terms of mass ratio (A:B). When the light transmittance at a wavelength of 400 nm is X, the light transmittance at a wavelength of 550 nm is Y, and the light transmittance at a wavelength of 1,000 nm is Z in a spectrum of a dispersion in which the mixed powder is dispersed in a concentration of 50 ppm, X&#x3e;10%, Y&#x3c;10%, Z&#x3c;16%, X/Y is 1.25 or more, and Z/Y is 2.0 or less.

Black-film-forming mixed powder

A silver-coated resin particle including a heat-resistant resin core particle and a silver coating layer formed on the surface of the resin core particle. The average grain diameter of the resin core particle is 0.1 to 10 &#x3bc;m, the amount of silver contained in the silver coating layer is 60 to 90 parts by mass, relative to 100 parts by mass of the silver-coated resin particle, and the exothermic peak temperature of the silver-coated resin particle by differential thermal analysis is 265&#xb0; C. or higher.

Silver-coated resin particles, method for manufacturing same, and electroconductive paste using same

A conductive paste includes: a silver-coated resin; and an organic vehicle that includes a thermosetting resin composition, a curing agent, and a solvent, in which the thermosetting resin composition is an epoxy resin composition which is solid at room temperature and has a melt viscosity of 0.5 Pa&#xb7;s or lower at 150&#xb0; C., and a mass ratio of a content of the thermosetting resin composition to a content of the silver-coated resin is 10 to 40:60 to 90.

Conductive paste

Provided are highly reliable silver-coated conductive particles, which are prevented from an occurrence of migration, the silver-coated conductive particles in which: a tin layer is formed on a surface of each spherical base particle, and a silver plating layer is formed on a surface of the tin layer, and a surface of the silver plating layer is coated with a water repellent layer: the water repellent layer includes an organic sulfur compound that is mainly composed of a sulfide compound or a surfactant such as polyoxyethylene ethers: and a molded body that is formed by pressing the silver-coated conductive particles at a pressure of 14.7 MPa has a contact angle with water of 125 degree or more.

Silver-coated conductive particles, conductive paste and conductive film

A first photosensitive liquid solution is applied to a substrate, patterned through exposure to radiation and development, and annealed to form a desired solid material, such as SrBi.sub.2 Ta.sub.2 O.sub.9, that is incorporated into a component of an integrated circuit Fabrication processes are designed protect the self-patterned solid material from conventional IC processing and to protect the conventional materials, such as silicon, from elements in the self-patterned solid material. In one embodiment, a layer of bismuth oxide is formed on the SrBi.sub.2 Ta.sub.2 O.sub.9 and a silicon oxide hole is etched to the bismuth oxide. The bismuth oxide protects the SrBi.sub.2 Ta.sub.2 O.sub.9 from the etchant, and is reduced by the etchant to bismuth. Any remaining bismuth oxide and much of the bismuth are vaporized in the anneal, and the remaining bismuth is incorporated into the SrBi.sub.2 Ta.sub.2 O.sub.9.

Method of fabricating an integrated circuit using self-patterned thin

Solution films of a photosensitive metal arylketone alcoholate are micro-patterned by exposure to ultraviolet radiation under a mask. The resultant patterns are developed in an apolar solvent and annealed to provide thin film metal oxides for use in integrated circuits.

Shelf-stable liquid metal arylketone alcoholate solutions and use

A photosensitive liquid solution is used to make thin films for use in integrated circuits. The photosensitive liquid solution contains a photo initiator, and solvent, and a mixture of metals bonded to free-radical-susceptible monomers. The metals are mixed in amounts corresponding to the desired stoichiometry of a metal oxide thin film that derives from the. The photosensitive liquid solution is applied to a substrate, soft baked, and exposed to ultraviolet radiation under a photo mask. The ultraviolet radiation patterns the soft-baked film through a free radical polymerization chain reaction. A solvent etch is used to remove the unpolymerized portion of the polymerized film. The remaining thin film pattern is annealed to provide a patterned metal oxide film.

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Akita, Japan

Kensuke Kageyama