Toyota Jidosha Kabushiki Kaisha

Espec Corporation

Kensuke Akamatsu

Hiroshi Yanagimoto

Yuki Sato

Motoki Hiraoka

Osamu Matsuguma

Takeshi Bessho

Yoshitaka Shimmei

Hidemi Nawafune

A nickel solution for forming a film that can suppress generation of hydrogen gas between a solid electrolyte membrane and a substrate while the solid electrolyte membrane and the substrate are brought into contact with each other. The pH of the nickel solution for forming a film is in the range of 4.2 to 6.1. The nickel solution for forming a film further contains a pH buffer solution that has a buffer function in the range of the pH and does not form insoluble salts or complexes with the nickel ions during formation of the film.

Nickel solution for forming film and film-forming method using same

An environmental chamber includes a testing tub in which a testing space is formed. The testing tub has a front wall, a left sidewall, a right sidewall, a rear wall, and a ceiling part, and is divided into a lower tub part and an upper tub part by a dividing surface extended in a direction inclined downwardly and frontwardly. The left and right sidewalls are respectively divided into two portions by the dividing surface. An inner surface of the upper tub part includes at least a part of an inner surface of each of the ceiling part, the front wall, the left sidewall, and the right sidewall. The upper tub part is supported by the lower tub part to be able to open the testing space.

Environmental chamber

According to the present invention, a circuit board having a further-microfabricated circuit pattern that can be manufactured in further simplified steps is obtained. For such purpose, a moldwhich has protrusionsformed in a pattern corresponding to a circuit pattern, is used to apply a conductive material layer (metal paste)to head portions of the protrusionsof the mold. The mold is heat- and pressure-welded to the surface of a substratethat is made of a resin film or the like. Accordingly, a pattern comprising the protrusionsand the conductive material layer (metal paste)are transferred to the substrateAfter transfer, the resin substrate (resin molding) is immersed in a copper sulfate plating bath for electrolytic plating treatment. Copper ions in the plating bath were deposited inside each recesswhile the conductive material layeris used as a base material for the formation of a metal wiring A pattern of the recessestransferred to the substrate-side is determined depending on a pattern comprising the protrusionson the mold. Thus, a microfabricated high-density circuit pattern formed with metal wiringshaving arbitrary aspect ratios can be obtained.

Method for manufacturing a circuit board

Growing community of inventors

Kobe, Japan

Kensuke Akamatsu