Fuji Electric Co., Ltd.

Kenshi Kai

Rikihiro Maruyama

Mitsutoshi Sawano

Nobuyuki Kanzawa

Kazuya Adachi

Yoshihiro Miyazaki

Makoto Isozaki

A semiconductor device including an insulated circuit board. The insulated circuit board includes an insulating board having an outer edge and a plurality of corners, and a plurality of circuit patterns formed on a front surface of the insulating board. The plurality of circuit patterns have a plurality of outer-edge corners facing the outer edge of the insulating board, among which outer-edge corners corresponding to the corners of the insulating board are smaller in curvature than outer-edge corners that do not correspond to the corners of the insulating board.

Semiconductor device

A semiconductor device manufacturing method includes: applying solder to an arrangement area of a substrate, the substrate having a connection area to which a wiring member is to be directly connected, the connection area neighboring the arrangement area; arranging a component on the arrangement area via the solder; and soldering the component to the arrangement area by heating the solder while covering the connection area. A soldering support jig includes a columnar covering member having a covering surface at a bottom of the columnar covering member.

Semiconductor device manufacturing method and soldering support jig

A conductive plate has a front surface at a front side and a rear surface at a rear side. The front surface includes a first front surface on which a first arrangement region is disposed and a second front surface on which a second arrangement region is disposed. The first front surface has a height measured from the rear surface that is different from a height of the second front surface measured from the rear surface. Next, first and second bonding materials are respectively applied to the first and second arrangement regions. A first part is bonded to the first arrangement region via the first bonding material, and a second part is bonded to the second arrangement region via the second bonding material. The heights of the first and second arrangement regions set on the front surface on the conductive plate are different from each other.

Semiconductor device manufacturing method

A semiconductor device including an insulated circuit board on which a semiconductor chip is mounted, and a housing implemented by a plurality of side-walls including at least a first pair of facing side-walls, each of the facing side-walls having joint edges configured to be jointed with the insulated circuit board, and each of the joint edges has an arc-shape such that a center in an extending direction of the joint edge protrudes toward the insulated circuit board more than both ends of the extending direction of the joint edge.

Semiconductor device and method for manufacturing semiconductor device

In a semiconductor device, protective films are formed on facing side surfaces of a plurality of circuit patterns and a plating process or the like is not performed on parts aside from the side surfaces where the protective films are formed. This means that when semiconductor elements and contact elements are directly bonded via solder onto the plurality of circuit patterns, a drop-in wettability of the plurality of circuit patterns for the solder is avoided.

Semiconductor device having bonding regions exposed through protective films provided on circuit patterns onto which components are soldered

A mounting jig for a semiconductor device includes an insulated circuit board positioning jig having a concave part in which an insulated circuit board is placed, a tubular contact element positioning jig disposed on an upper side of the insulated circuit board and having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig having a flat plate and a plurality of projections extending from a lower surface of the flat plate. The plurality of projections includes a first length from the flat plate on a side closer to an outer circumference of the insulated circuit board, and a second length from the flat plate inside the outer circumference of the insulated circuit board. The first length is shorter than the second length.

Mounting jig for semiconductor device

After a contact component is disposed in a concave joint space, when a solder solidifies, the solder thickness of the solder in the joint space is kept. Thus, a contact area between the contact component and the solder is kept, and the solder thickness of the solder that joins the contact component and a conductive pattern is kept. In addition, since an appropriate amount of the solder is kept in the joint space, an extra amount of solder does not need to be applied in advance. As a result, there is prevented creeping up of the solder into a hollow hole of the contact component, caused by the heat applied when the contact component is joined to the conductive pattern.

A flange on first open end of a tubular contact member is soldered to a conductive plate of an insulating substrate. An external electrode terminal is fitted into a main body tube portion of the tubular contact member. The tubular contact member includes a protrusion that protrudes inwardly from an inner wall of the main body tube portion. The protrusion is disposed along the entire perimeter of inner wall toward the first open end. The protrusion has a thickness deformation of the protrusion by a load applied thereto when the external electrode terminal is pressed into the main body tube portion. The protrusion is disposed at a height that can block solder that climbs the inner wall of the main body tube portion, to form a gap between the protrusion and a lower end of the external electrode terminal inserted to a predetermined depth of the main body tube portion.

Semiconductor device, metal member, and method of manufacturing semiconductor device

A mounting jig for a semiconductor device includes an insulated circuit board positioning jig positioning an insulated circuit board by housing the insulated circuit board at a predetermined position, a tubular contact element positioning jig having a plurality of positioning holes at predetermined positions to insert a plurality of tubular contact elements respectively, and a tubular contact element press-down jig for pressing down the plurality of tubular contact elements inserted into the respective positioning holes in the tubular contact element positioning jig.

A method of manufacturing a semiconductor device uses a mounting jig having an insulated circuit board positioning jig, a tubular contact element positioning jig having a plurality of positioning holes formed at predetermined positions to insert a tubular contact element, and a tubular contact element press-down jig. By the insulated circuit board positioning jig and tubular contact element positioning jig, an insulated circuit board and the tubular contact elements are positioned, and the tubular contact elements are soldered to the insulated circuit board while being pressed down by the tubular contact element press-down jig.

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Matsumoto, Japan

Kenshi Kai