University of Michigan

Other

Delco Electronics Corporation

Glaukos Corporation

The Board of Regents Acting for and on Behalf of the University of

The United States of America As Represented by the United States

Kensall D Wise

Khalil Najafi

Hin-Leung Chau

Johannes W Schwank

Mayurachat Ning Gulari

John L Gland

Razi-ul M Haque

David S Haffner

Jingkuang Chen

Joseph A Potkay

Abhijeet V Chavan

Ying Yao

Yu-Ting Cheng

Liwei Lin

Angelique Johnson

Yogesh B Gianchandani

Katsuo Kurabayashi

Leland Joseph Spangler

Richard D Sacks

David E Solomon

David Lemmerhirt

Kenichi Takahata

Edward T Zellers

Kenichiro Suzuki

Bruce P Block

Andrew D DeHennis

Merrill G Robinson

Gilbert H Wuttke

Gayatri Eadara Perlin

Jin Ji

Janet K Robertson

Brendan E Casey

Steve T Cho

Nino A Masnari

Walter B Rensel

Patty P L Chang-Chien

Katharine T Beach

Masoud Agah

Sung Jin Kim

Christy L Johnson

Razi-Ul Haque

Razi-Ul M Haque

An implantable intraocular physiological sensor for measuring a physiological characteristic, such as intraocular pressure. The implantable intraocular physiological sensor may include a tubular main body configured to house one or more electrical components. The implantable intraocular physiological sensor may also include a sensor cap configured to be inserted into a first end of the tubular main body with a moisture barrier seal. The implantable intraocular physiological sensor may wirelessly transmit measurements to an external device.

Intraocular physiological sensor

An electrode array, having application as a cochlear implant, includes a tube formed of Parylene defining a hollow channel. A substrate formed primarily of Parylene is supported by the tube. In turn, a plurality of metallic electrodes and feed lines are supported by the substrate. Numerous voids are defined by the tube which opens into the hollow channel. The size and spacing of the voids regulate stiffness and curl of the tube to provide excellent fit within the cochlea.

Electrode array and method of fabrication

A method of embedding material in a glass substrate is provided. The method includes providing a glass composition and a mold substrate having a patterned surface defining a recess therein. The mold substrate is formed from a material having a higher reflow temperature than the glass composition. A surface wettability of the patterned surface is increased relative to the glass composition. At least a portion of the glass composition is flowed into the recess defined by the patterned surface of the mold substrate, followed by solidifying the glass composition to form a solidified glass layer. Material is removed from the solidified glass layer until a portion of the underlying patterned surface of the mold substrate is exposed with at least a portion of the mold substrate embedded in the solidified glass layer to thereby form the glass substrate having the material embedded therein.

Method of embedding material in a glass substrate

A two-dimensional gas chromatography system having first and second separation columns, a thermal modulator disposed between the first and second columns and having a plurality of stage channels, and a micro heater monolithically integrated in the thermal modulator. The thermal modulator is operable to trap and focus gas/vapor species within the plurality of stage channels upon cooling and release the gas/vapor species to the second column upon heating by the micro heater.

Microfabricated thermal modulator for comprehensive 2D gas chromatography

A microsystem comprising a substrate having an aperture formed therethrough. The aperture includes a first cross-section and a second cross-section&#x2014;the first cross-section being smaller than the second cross-section to define a ledge therebetween. A probe member is disposed within the aperture of the substrate, such that a backend of the probe member defines a cross-section that is greater than the first cross-section of the aperture and smaller than the second cross-section such that the probe member engages the ledge. A plurality of probe shanks extend from the probe member. Each of the probe shanks includes a plurality of leads disposed there along. Each of the leads extending from the probe shanks to an opposing side of the probe member.

Compact multilevel electrical integration of microsystems

A device includes a first device structure having a semiconductor platform, and a second device structure having a microstructure spaced from the semiconductor platform. The device further includes a cable having a plurality of beams to couple the microstructure to the first device structure. Each beam of the plurality of beams has a polymer coating and a serpentine-shaped region.

Wafer-level, polymer-based encapsulation for microstructure devices

Disclosed herein is a method of fabricating a device having a microstructure. The method includes forming a connector on a semiconductor substrate, coating the connector with a polymer layer, and immersing the semiconductor substrate and the coated connector in an etchant solution to form the microstructure from the semiconductor substrate and to release the coated connector and the microstructure from the semiconductor substrate such that the microstructure remains coupled to a further element of the device via the coated connector. In some cases, the microstructure is defined by forming an etch stop in the semiconductor substrate, and the microstructure and the semiconductor substrate are coated with a polymer layer, which may then be selectively patterned. The microstructure may then be released from the semiconductor substrate in accordance with the etch stop.

Disclosed herein is a stent device useful for maintaining the patency of a lumen while monitoring an intraluminal characteristic. The device includes a structure having a set of extendible bands that are capable of plastic deformation to form a scaffolding having an inductance, and further includes a capacitance coupled to the set of extendible bands and responsive to the intraluminal characteristic. The capacitance and the inductance form a tank circuit after the plastic deformation of the set of extendible bands to enable wireless transmission of an indication of the intraluminal characteristic.

Antenna stent device for wireless, intraluminal monitoring

A microvalve device includes a semiconductor-based valve housing that defines a flow passage, and a valve face disposed within the valve housing and in fluid communication with the flow passage. The microvalve device further includes a thermal expansion actuator that drives movement of the valve face from a first position to a second position relative to the flow passage, and a capacitor that holds the valve face in the second position. The microvalve may also include an insulating layer disposed on portions of the semiconductor-based valve housing, and a capacitance sensor for monitoring a capacitance level to determine when the valve face reaches the second position. Once the sensor indicates that the second position has been reached, power is no longer applied to the thermal expansion actuator such that power is only substantially consumed during the transition from the first position to the second position. The thermal expansion actuator may include a heating element and a thermal expansion substance for thermopneumatic displacement of the valve face.

Thermopneumatic microvalve

A method and system for locally sealing a vacuum microcavity, methods and systems for monitoring and controlling pressure in the microcavity and method and system for trimming resonant frequency of a microstructure in the microcavity are provided. The microcavity has an initial base pressure therein after the microcavity is locally sealed at an access passageway. The monitoring and control methods include measuring pressure in the microcavity and providing a signal when the pressure exceeds a maximum desired level. The control method also includes reducing the pressure in the microcavity to a pressure at or below the maximum desired level in response to the signal to compensate for vacuum degradation within the vacuum microcavity.

METHOD AND SYSTEM FOR LOCALLY SEALING A VACUUM MICROCAVITY, METHODS AND SYSTEMS FOR MONITORING AND CONTROLLING PRESSURE AND METHOD AND SYSTEM FOR TRIMMING RESONANT FREQUENCY OF A MICROSTRUCTURE THEREIN

A method and system for locally connecting microstructures and devices formed thereby are provided wherein localized solder-bonding creates bonds between pairs of microstructures found on miniature flexible cables and silicon microsystem platforms. Multi-lead contact to the pads are detected automatically, triggering an embedded heater or heaters to initiate solder melting. This approach enables delicate microstructures to be connected and disconnected from microsystem platforms in the field, and is implemented with a process that is compatible with monolithic integration of circuits.

Method for electrically and mechanically connecting microstructures using solder

A high-sensitivity, separation microcolumn assembly for a microgas chromatograph and the like is provided. The assembly has an ultra-low mass complete with integrated heaters. The assembly uses multiple zones for temperature control, and microstructures that permit very rapid heating and cooling of the microcolumn.

Separation microcolumn assembly for a microgas chromatograph and the like

A method for making a microstructure assembly, the method including the steps of providing a first substrate and a second substrate; depositing an electrically conductive material on the second substrate; contacting the second substrate carrying the electrically conductive material with the first substrate; and then supplying current to the electrically conductive material to locally elevate the temperature of said electrically conductive material and cause formation of a bond between the first substrate and the second substrate.

Microstructures

Growing community of inventors

Ann Arbor, MI, United States of America

Kensall D Wise