Kyocera Corporation

Kensaku Murakami

Yousuke Moriyama

Kouichi Kawasaki

Yurie Onitsuka

Kenjirou Fukuda

An electronic-component mount substrate includes a substrate having a first principal surface and a second principal surface opposite to the first principal surface; a mount electrode for mounting an electronic component on the first principal surface, the mount electrode having a first slit and sandwiching the first slit; a plane electrode surrounding the mount electrode in a plan view and having a second slit; a connection electrode connecting the mount electrode with the plane electrode; and an outer electrode on the second principal surface. The connection electrode overlaps the outer electrode and an outer edge of the outer electrode surrounds the connection electrode in a perspective plan view.

Electronic-component mount substrate, electronic device, and electronic module

A wiring board includes an insulating substrate, mount electrodes arranged to face each other on a first main surface of the insulating substrate along a pair of opposing sides of the insulating substrate in a plan view, and terminal electrodes arranged to face each other on a second main surface of the insulating substrate along another pair of opposing sides of the insulating substrate in a perspective plan view.

Wiring board, electronic device, and electronic module

A light-emitter mounting package includes an insulating base, a wiring conductor, and a metal layer. The insulating base has a main surface including a recess in which a light emitter is mountable. The wiring conductor is arranged on a peripheral portion of a bottom surface of the recess that is adjacent to an inner wall of the recess. The insulating base has a side surface including a sloping surface adjacent to the main surface. The metal layer is spaced from the wiring conductor, and extends on the inner wall of the recess, the main surface, and the sloping surface.

Light-emitter mounting package, light-emitting device, and light-emitting module

An electronic component mounting substrate includes an insulating base having a rectangular shape in plan view and including a first main surface, a second main surface facing the first main surface, and a recess open on the first main surface, a band-shaped metal layer on a sidewall of the recess, and an electrode extending from a bottom surface of the recess into the insulating base. The electrode has an end disposed in the insulating base, and the end includes an inclined portion inclined toward the second main surface.

Electronic component mounting substrate, electronic device, and electronic module

A wiring board includes a ceramic insulating base; a recessed portion provided on a side surface of the insulating base, the recessed portion being connected to one main surface of the insulating base; an internal wiring conductor disposed in an interior of the insulating base; an external wiring conductor disposed on one main surface of the insulating base; a recessed portion wiring conductor disposed in the recessed portion, the recessed portion wiring conductor being connected to the internal wiring conductor and the external wiring conductor; and a through conductor disposed in an interior of the insulating base, the through conductor electrically connecting the internal wiring conductor and the external wiring conductor. In a see-through plan view of the insulating base from a one main surface side, the recessed portion extends in one direction, and the through conductor is disposed in a periphery of an end portion of the recessed portion.

Wiring board, electronic device, and light emitting apparatus

This wiring board is provided with: an insulating base that has a lateral surface having an incision part; an electrode that is provided on the inner surface of the incision part; and a wiring conductor that is provided within the insulating base or on the surface of the insulating base and is electrically connected to the electrode via a connection conductor. The width of the incision part is larger than the depth thereof, and the connection conductor is connected to the electrode at an end of the incision part in the width direction. An electronic device according to the present invention is provided with this wiring board and an electronic component that is mounted to the upper surface of this wiring board.

Growing community of inventors

San Diego, CA, United States of America

Kensaku Murakami