Seiko Epson Corporation

Kensaku Isohata

Takayuki Kikuchi

Manabu Kondo

Takemi Yonezawa

Atsushi Kiyohara

Kenji Hayashi

Masayuki Ishikawa

Katsuhiko Maki

Matsutaro Naito

A method for manufacturing oscillators of a plurality of types including a first oscillator and a second oscillator, the method includes: manufacturing the first oscillator, the manufacturing the first oscillator including a first-oscillator first step of mounting, to a first container, a first resonator element and a first circuit element configured to oscillate the first resonator element to generate a first oscillation signal, and a first-oscillator second step of mounting, to the first container, a second resonator element whose oscillation frequency is controlled based on the first oscillation signal; and manufacturing the second oscillator, the manufacturing the second oscillator including a second-oscillator first step of mounting a third resonator element and a second circuit element to a second container of the same type as the first container, the third resonator element being of the same type as the first resonator element and the second circuit element being of the same type as the first circuit element and being configured to oscillate the third resonator element to generate a second oscillation signal, and a second-oscillator second step of mounting, to the second container, a fourth resonator element whose oscillation frequency is controlled based on the second oscillation signal and whose frequency is different from the frequency of the second resonator element.

Method for manufacturing oscillator

An oscillator includes a first resonator element, a circuit element configured to oscillate the first resonator element to generate an oscillation signal, a first package which includes a substrate, and has a housing space configured to house the first resonator element and the circuit element at one principal surface side of the substrate, a second resonator element which is disposed at another principal surface side of the substrate, and an oscillation frequency of which is controlled based on the oscillation signal, and a leg part which is disposed at the another principal surface side of the substrate, and which is arranged so as to surround the second resonator element in a plan view of the substrate.

Oscillator

A package includes a base member and a first projecting portion that projects from one surface of the base member. The first projecting portion contacts a first substrate on which an electronic component is mounted, and has an insulating property.

Electronic component package, oscillator, electronic apparatus, and base station

An oscillator includes a case that has a base and a cap connected to the base; a first substrate accommodated in the case; a lead terminal electrically connected to the first substrate; and a resonator module electrically connected to the lead terminal and supported by the lead terminal with a gap with respect to the first substrate between the first substrate and the base.

Oscillator and electronic device

An oscillator includes an oscillation source, multiple temperature control elements, and a controller adapted to perform control to suppress an increase in current consumed in one or more of the temperature control elements during at least part of a period from when operation of the oscillation source initiates to when the oscillation source reaches a specified temperature.

Oscillator, electronic apparatus, and base station

An integrated circuit device includes a substrate, a joining part provided on the substrate and joined to a vibrator, and a plurality of bonding pads provided on the substrate. The joining part includes an insulating protective film that covers a part of a surface of the substrate, and no insulating protective film is provided between the adjacent bonding pads.

Integrated circuit device, electronic device, electronic apparatus, and base station

An oscillator including a container, a first protrusion portion protruding from the container along a first direction, a second protrusion portion protruding from the container along the first direction, and a projection portion protruding from the container along the first direction. The second protrusion portion is shorter than the first protrusion portion in the first direction, and the projection portion is longer than the second protrusion portion and shorter than the first protrusion portion in the first direction.

Electronic component, electronic apparatus, and moving object

An electronic component includes a wiring substrate, a heating element, a first support, a second support, and a container. The heating element, the first support, and the second support are electrically connected to the wiring substrate. Each of the first support and the second support includes a protrusion portion, and the protrusion portion of the second support is shorter than the protrusion portion of the first support.

An oscillator includes: an integrated circuit including a circuit for oscillation; a resonator element; a circuit element; a heating element, and a container. The integrated circuit, the resonator element, and the heating element are arranged inside the container. The circuit element is arranged outside the container.

Oscillator, electronic apparatus, and moving object

An electronic device includes a resonator provided with a heating element, and a circuit component opposed to the heating element, and provided with at least an oscillating amplifier element, and a distance between the heating element and the circuit component is in a range not smaller than 0 mm and no larger than 1.5 mm.

Electronic device, electronic apparatus, and moving object

A method of adjusting a frequency of a resonation device including a resonator element and a heating element includes performing the frequency adjustment of the resonator element while heating the resonator element by the heating element.

Growing community of inventors

Minowa-machi, Japan

Kensaku Isohata