Jsr Corporation

Kenrou Tanaka

Keisuke Kuriyama

Kenzou Ookita

Hitoshi Hamaguchi

The present invention relates to: a method of producing a structure having a recessed pattern; a resin composition; a method of forming an electroconductive film; an electronic circuit; and an electronic device. The method of producing a structure having a recessed pattern includes the following steps (i) and (ii), and the recessed pattern has a film thickness that is thinner by 5% to less than 90% with respect to that of a coating film obtained in the step (i):

Method for manufacturing structure having recessed pattern, resin composition, method for forming electroconductive film, electronic circuit, and electronic device

The thin film transistor includes a first insulating layer provided on a substrate; a source electrode and a drain electrode that are provided on the first insulating layer; a semiconductor layer provided so as to cover the first insulating layer, the source electrode, and the drain electrode; a second insulating layer provided on the semiconductor layer; and a gate electrode provided on the second insulating layer, in which the first insulating layer is formed of a hydrophilic/hydrophobic material and has a recess portion, and the source electrode and the drain electrode are provided so as to fill the recess portion of the first insulating layer.

Thin film transistor and MOS field effect transistor that include hydrophilic/hydrophobic material, and methods for manufacturing the same

A process for producing a substrate having wiring includes steps (i) to (v) described as follows: (i) applying a radiation-sensitive composition on a substrate to form a coating film; (ii) irradiating a prescribed part of the coating film with radiation to allow the coating film to have a radiation-irradiated region and a radiation-unirradiated region; (iii) allowing the coating film obtained in the step (ii) to have a concave region and a convex region; (iv) forming wiring on the concave region; and (v) removing the convex region by an application of radiation or by heating.

Process for producing substrate having wiring, radiation-sensitive composition, electronic circuit and electronic device

Provided is a method for manufacturing a substrate having a concave pattern to be used for forming a high-definition pattern while suppressing wet-spreading and bleeding of a film-forming ink, provided is a composition to be used for manufacturing the substrate, and provided are a method for forming a conductive film, an electronic circuit, and an electronic device. The method for manufacturing a substrate having a concave pattern includes: (i) a step of applying, on a substrate, a composition containing a polymer having an acid-dissociable group and an acid generator to form a coating filmand (ii) a step of irradiating a predetermined portion of the coating filmwith radiation. The method for forming a conductive film includes applying a conductive film-forming ink on the concave pattern formed in the exposed portion of the coating filmand heating the ink to form a pattern. The electronic circuit and the electronic device are provided by using the method for forming a conductive film.

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Tokyo, Japan

Kenrou Tanaka