Shin-etsu Polymer Co., Ltd.

Kenro Takizawa

Kazuhiro Suzuki

Junya Ishida

Yuzo Morioka

Michimasa Ote

Takashi Gonda

Takashi Nogami

Masaru Yoneyama

When extrusion of a molten resin by means of an extruder is started, a simple polyetherimide resin is melt extruded from a lip portionof a T-die, and a film of the simple polyetherimide resin is molded. The molding material is then switched to a resin composition including the polyetherimide resin and a fluorine resin and then a film of the resin composition is continuously extruded and molded from the T-die. Having been covered with a very thin filmof the simple polyetherimide resin, on a flow passage face of the lip portionof the T-die, a resin composition layerincluding a polyetherimide resin and a fluorine resin, which has affinity with the film, is then formed at a center part.

Method of manufacturing film for film capacitor and film for film capacitor

A film for film capacitors having a thickness of 10 microns or less, is manufactured by the successive steps of: mixing and preparing a forming material composed of a thermoplastic resin composition; melting and extruding the forming material to a film through a T-die; pinching and cooling the film between a pressure roll and a cooling roll having a rough surface for forming a rough surface to the film, wherein the rough surface of the cooling roll has (&#x3c3;/Ra) of 0.2 or less, and the rough surface of the film has (&#x3c3;/Ra) of 0.2 or less, where (Ra) is an arithmetic average roughness defined by a method specified in JIS B 0601 2001, and (&#x3c3;) is a standard deviation; and rolling up the cooled film onto a winding tube in a winding unit.

Method for manufacturing film for film capacitor

The present invention provides a resin film for a film capacitor making it possible to obtain the excellent heat resistance, materialize a reduction in a size of the film capacitor and an increase in a capacity thereof and satisfy a reduction in a thickness of the film and a high voltage resistance thereof. In a manufacturing method in which an extruding equipmentis charged with a molding materialto extrude a filmfor a film capacitor from a T dice, in which the above extruded filmfor a film capacitor is interposed between plural rolls in a receiving deviceand cooled and in which the above cooled filmfor a film capacitor is wound on a winding tubeof a winding device, 100 parts by mass of a polyetherimide resin is blended with 1 to 10 parts by mass of a fluorocarbon resin to prepare the molding material; the above molding materialis extruded through a filterhaving apertureswhich are 0.5 to 6 times or less as large as an average thickness of the filmfor a film capacitor, which is provided between the extruding equipmentand the T dice; and a thickness of the filmfor a film capacitor is controlled to 10 &#x3bc;m or less.

Method for manufacturing resin film for thin film-capacitor and the film therefor

The present invention provides a method for manufacturing a film for a film capacitor making it possible to produce a film for a film capacitor which has a thickness of 10 &#x3bc;m or less and which is excellent in a heat resistance and a voltage resistance at a high thickness accuracy by using a polyetherimide resin and provides as well a film for a film capacitor. The above manufacturing method comprises the steps of:

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Saitama, Japan

Kenro Takizawa