Agilent Technologies, Inc.

Keysight Technologies, Inc.

Hewlett-Packard Company

Other

Kenneth William Johnson

Brock J LaMeres

Brent Anthony Holcombe

Edward Vernon Brush

Michael Thomas McTigue

Thomas J Zamborelli

Larry Bartosch

A high-voltage active measurement probe is for a measurement instrument such as an oscilloscope. The high voltage active measurement probe includes an input terminal configured to receive an input signal from a device under test (DUT), a first output terminal configured to transmit a first output signal to the measurement instrument for measurement and display of peak voltages, and a second output terminal configured to transmit a second output signal to the measurement instrument for high sensitivity measurement and display of low level voltages. A first probe signal path is between the input terminal and the first output terminal, and a second probe signal path between the input terminal and the second output terminal. A first amplifier is in the first probe signal path between the input terminal and the first output terminal, and a second amplifier is in the second probe signal path between the input terminal and the second output terminal. A first attenuator is in the first probe signal path between the input terminal and the first amplifier, and a second attenuator in the second probe signal path between the input terminal and the second amplifier. A clamping circuit is in the second signal path between the second amplifier and the second output terminal and configured to clamp an internal probe signal, e.g. between an upper clamping threshold and a lower clamping threshold, to produce the second output signal.

Dual output high voltage active probe with output clamping and associated methods

An oscilloscope system includes a current probe, a processing unit and a display unit. The current probe includes a high and low gain signal paths for receiving simultaneously a signal of interest from a device under test (DUT), and to output amplified small and large current portions of the signal of interest, respectively. The processing unit receives first and second digitized data corresponding to the amplified small and large current portions output by the high and low gain signal paths, respectively, and processes the first and second digitized data for display as zoomed-in and zoomed-out waveform data, respectively. The display unit displays simultaneously a zoomed-in waveform in a first display window, based on the zoomed-in waveform data, and a zoomed-out waveform in a second display window, based on the zoomed-out waveform data, using the same time scale. The small current portion is less than a predetermined threshold.

Oscilloscope system and method for simultaneously displaying zoomed-in and zoomed-out waveforms

A probe for a measurement instrument comprises an input terminal configured to receive an input signal from a device under test (DUT), an output terminal configured to transmit an output signal to a measurement instrument, and a clamping circuit disposed in a signal path between the input terminal and the output terminal and configured to clamp an internal probe signal between an upper clamping threshold and a lower clamping threshold to produce the output signal, wherein the clamping circuit operates with substantial gain and amplitude linearity throughout a range between the upper clamping threshold and the lower clamping threshold.

Oscilloscope probe having output clamping circuit

A measurement probe comprises at least one input port configured to receive an input signal generated in relation to a device under test (DUT), and an amplification unit configured to amplify the input signal with a first gain where the input signal has a first amplitude, and further configured to amplify the input signal with a second gain lower than the first gain where the input signal has a second amplitude greater than the first amplitude.

Measurement probe providing different levels of amplification for signals of different magnitude

A current probe enabling measurement of current of a signal in a circuit includes a ferrite core defining a gap, a wire wrapped around the ferrite core and a magnetic field sensor. The wire is configured to receive the signal from the circuit, where the current of the signal flowing in the wire generates a magnetic field in the ferrite core. The magnetic field sensor is positioned in the gap of the ferrite core, the magnetic field generated in the ferrite core flowing through the magnetic field sensor, which produces a voltage proportional to an intensity of the magnetic field. The current is measured based on the voltage produced by the magnetic field sensor.

Closed core current probe

An oscilloscope current probe system includes a probe amplifier unit, a probe head identifier, and first and second probe heads interchangeably connectable to the probe amplifier unit. Each probe head has a respective electrically-readable type identifier, a respective current input to receive a current to be measured, a respective internal sensing resistor in connected series with the current input, and a respective output at which a measurement voltage across the sensing resistor is output. The first and second probe heads differ in the resistance of their sensing resistors and the way their type identifiers read. The probe amplifier unit includes a differential amplifier to amplify the measurement voltage output by the probe head connected thereto. The probe head identifier is to read the type identifier of the probe head connected to the probe amplifier unit.

Oscilloscope current probe with interchangeable range and sensitivity setting modules

An apparatus and method includes an integrated circuit disposed in a ball grid array ('BGA') package having interconnects on at least one corner without signal assignments.

Ball grid array package

Probe accessories, and methods for routing signals between a target and a test instrument using the probe accessories, are disclosed. Some of the probe accessories include a flexible circuit and first and second pairs of contacts. Flexible circuit design varies, but one embodiment has first and second regions, a first conductor and a second conductor, and a separation feature. The first conductor extends into the first region while the second conductor extends into both the first and second regions and has a fixed spacing with respect to the first conductor. A separation feature extends between first and second regions and is operable to create two independently maneuverable legs, each leg comprising an end portion of the first and second regions, while maintaining a fixed spacing between the first and second conductors. The first and second pairs of contacts electrically couple the probe accessories between test points and test instruments.

Probe accessories, and methods for probing test points using same

A probe for an array of interconnecting leads between a PCA and an IC has one or more contacts extending laterally from or plated upon one or more arms formed of a flexible printed circuit, and connected by traces along the arm(s) to a header that itself affords connection to measurement equipment. The flexible printed circuit is thin enough to loosely slide between the top of the PCA or PCB and the bottom of the IC. The arm or arms is/are narrow enough to slide between the adjacent leads forming the array, while the normally flat contacts will successively interfere with, to engage and electrically contact, consecutive layers of leads as the probe is progressively inserted. An arm is not so stiff that it cannot yield by a slight compressive warping as the contacts encounter leads. Indexing may be 'by feel' or by visible indicia along a top surface of the probe or by a reticle device that moves over the top of the IC, which then has a pattern of indicia corresponding to lead location. Forming the shape of a Kapton substrate may also include use of a CVL operating in the range of 250 nm to 290 nm for the creation of extended copper contacts by the removal of underlying Kapton. Plating processes may also be used in the fabrication of (non-extended) wrap-around contacts at the edges of the Kapton.

Method and apparatus for probing at arbitrary locations within an inaccessible array of leads the solder balls or pins actually connecting a VLSI IC package to a substrate or socket

A ZIF connector is mounted on a tiny PCB that carries damping components and flying leads that are connected or soldered to locations of interest on a PCB. There may be one or many of such ZIF connector/connection accessories in any particular test set-up. A ZIF browser is connected to an active probe's tip by short flexible extended transmission lines that lead back to a small interconnect PCB having plated lands that are inserted into the ZIF connector. The ZIF connector is good for just a limited number of uses, but this is in agreement the a customer's usage model for an inexpensive 'disposable' part. Furthermore, the limited lifetime of the ZIF connector/connection accessory is apt to be mitigated in cases where several are in use at one time. The precision microwave connection of the ZIF browser to a potentially delicate and expensive probe tip need not be performed frequently for replacement of the ZIF browser, as the plating on the lands of the interconnect PCB is made thick enough to allow those lands to have a lifetime of 1,500 or more insertions, which is two to three times the amount research suggests is a typical customer expectation.

ZIF connection accessory and ZIF browser for an electronic probe

A board-to-board interconnect is presented. The interconnect is fashioned from solder beads or hemi-ellipsoidal surface features on a surface of a printed circuit board and contact pads on a second printed circuit board.

Board-to-board electronic interface using hemi-ellipsoidal surface features

A probe retention kit may include a plurality of probe retention devices, each having: (i) a base; (ii) a retention mechanism, coupled to the base, for mechanically coupling a probe substrate with the plurality of probe retention devices; and (iii) solder legs to be inserted into a printed circuit board, the solder legs having opposite ends that extend through the base and provide an alignment mechanism for receiving the probe substrate. Alternative probe retention devices, and systems and methods using same, are also disclosed.

Probe retention kit, and system and method for probing a pattern of points on a printed circuit board

An apparatus, method, and kit for probing a pattern of points on a first printed circuit board are disclosed. In one exemplary embodiment, the apparatus includes a probe having i) a plurality of compression interconnects to probe the pattern of points on the first printed circuit board, and ii) a plurality of fixed pins that are electrically coupled to the compression interconnects. The fixed pins extend from the probe opposite the compression interconnects. The apparatus further includes a flexible wire interconnect having first and second sets of electrically coupled connectors, the first set of which is coupled to the fixed pins of the probe. A second printed circuit board has at least one first connector that is electrically coupled to at least one second connector. The at least one first connector is coupled to the second set of connectors of the flexible wire interconnect, and the at least one second connector is configured to couple to a test instrument.

Apparatus, method, and kit for probing a pattern of points on a printed circuit board

A probe for probing test points on a target board uses a printed circuit board (PCB) having a plurality of signal routes for routing signals to a test instrument. The probe also has a plurality of spring pins for probing the test points on the target board. Each of the spring pins is i) disposed perpendicularly to the PCB, and ii) electrically coupled to at least one signal route of the PCB. By way of example, the spring pins may be fit into holes in the PCB or, alternately, they may be electrically coupled to signal routes of a second PCB that is perpendicularly abutted to the first PCB. Methods for making and using such probes are also disclosed.

Probes with perpendicularly disposed spring pins, and methods of making and using same

An electronic probe extender. In representative embodiments, an electronic probe extender is disclosed which includes a probe connector that is capable of electronic contact to an electronic test probe, an electronic signal conductor connected electronically to the probe connector, and an electronic probe tip connected electronically to the signal conductor. The electronic probe tip includes a tapered electronically conductive tip. The electronic probe tip is capable of electronic connection to an electronic test point.

Growing community of inventors

Colorado Springs, CO, United States of America

Kenneth William Johnson