Grabit, Inc.

Intevac, Inc.

Kenneth Tan

Patrick Conall Regan

Harsha Prahlad

Kuo-Hung Lee

Chih-Chi Chang

Dragan Jurkovic

Chang-Chu Liao

Susan Kim

Matthew Thomas Leettola

Richard J Casler

Patrick Wang

Po Cheng Chen

John Mathew Farren

Aishwarya Varadhan

Jon Smith

Ming-Feng Jean

Howard Fu

Honam Ko

Tsung Tai Chien

TaeHoun Kim

Karthik Janakiraman

Judy H Huang

Qingde Chen

Greg Miller

Young Kyu Cho

Taehoun Kim

Tae-Houn Kim

John Matthew Farren

Systems, apparatus, and methods of manufacturing an article using electroadhesion technology for the pick-up and release of materials, respectively.

Methods and systems for electroadhesion-based manipulation in manufacturing

Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with vacuum for the pick up and release of materials, respectively.

Methods and systems for combined negative pressure and electroadhesion-based manipulation in manufacturing

Systems, apparatus, and methods of manufacturing an article using electroadhesion technology, either as a sole modality of handling such materials or in concert with at least one mechanically actuated modality for the pick-up and release of materials, respectively. The mechanically actuated modality in one embodiment is configured as a netting configured to be placed over a contact surface of an electroadhesive plate to facilitate the handling of an object.

Methods and systems for electroadhesion-based manipulation and mechanical release in manufacturing

A plasma processing chamber having capacitive and inductive coupling of RF power. An RF power source is connected to an inductive coil and to a top electrode via a variable capacitor to control the ratio of power applied to the coil and electrode. The bottom electrode, which is part of the chuck holding the substrates, is floating, but has parasitive capacitance coupling to ground. No RF bias is applied to the chuck and/or the substrate, but the substrate is chucked using DC power. In a system utilizing the chamber, the chuck is movable and is loaded with substrates outside the chamber, enter the chamber from one side for processing, exit the chamber from an opposite side after the processing, and is unloaded in an unloading chamber. The chuck is then transported back to the loading chamber. Substrates are delivered to and removed from the system using conveyor belts.

Inductive/capacitive hybrid plasma source and system with such chamber

Growing community of inventors

San Jose, CA, United States of America

Kenneth Tan