Texas Instruments Corporation

Kenneth Robert Rhyner

Peter R Harper

Rajen Manicon Murugan

Jie Chen

Django Trombley

Gary Paul Morrison

Stanley Craig Beddingfield

Chittranjan Mohan Gupta

Minhong Mi

Kevin P Lyne

David G Wontor

An integrated circuit (IC) package includes an IC die and a wave channel that electrically couples the IC die to a solder ball array. The wave channel is configured to resonate at an operating frequency band of the IC die.

Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.

A method for forming an integrated circuit package is disclosed. A flex circuit is form by forming a direct connect pad on a first side of a dielectric layer. After forming the direct connect pad, an opening from a second side of the dielectric layer is formed to expose the direct connect pad. A blind via is formed within the opening in the dielectric layer. A first conductor is formed within the opening. A bond pad of a semiconductor die is electrically coupled with the direct connect pad using a second conductor, wherein the bond pad and the second conductor directly overlie the direct connect pad.

Method of forming an integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad

A ball grid array (BGA) includes a plurality of metal balls adapted for connection between an electrical circuit and a substrate. A first portion of the BGA contains a first group of the metal balls arranged according to a first pitch. A second portion of the BGA contains a second group of metal the balls arranged according to a second pitch that is less than the first pitch, to provide increased metal contact area and correspondingly enhanced thermal transfer capability.

Integrated circuit packaging with ball grid array having differential pitch to enhance thermal performance

An integrated circuit package including a semiconductor die and a flexible circuit (flex circuit), and a method for forming the integrated circuit package. The flex circuit can include a direct connect pad which is not electrically coupled to an active trace, a blind via electrically coupled to the direct connect pad, and a semiconductor die having a bond pad which is electrically coupled to the direct connect pad using a conductor. The bond pad, the conductor, the direct connect pad, and the blind via can all be vertically aligned, each with the other.

Integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad

A semiconductor flip-chip ball grid array package () with one-metal-layered substrate. The sites () of a two-dimensional array become usable for attaching solder balls of the signal (non-common net assignment) I/O type to the substrate under the chip area (), when the sites can be routed for metal plating (). The space to place a maximum number () of signal routing traces is opened up by interrupting the periodicity of the site array from the edge () of the substrate towards the center under the chip. The periodicity is preferably interrupted by depopulating entire aligned lines and rows of the two-dimensional array.

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Rockwall, TX, United States of America

Kenneth Robert Rhyner