Western Digital (fremont), Inc.

Kenneth R Young

David John Seagle

Mohamad Towfik Krounbi

Arshad Ahmed Alfoqaha

Sandrawattie Sankar

An inductive transducer has inorganic nonferromagnetic material disposed in an apex region adjacent to a submicron nonferromagnetic gap in a magnetic core. The inorganic nonferromagnetic material has a much lower coefficient of thermal expansion than that of hardbaked photoresist, reducing pole tip protrusion even if other insulation surrounding the coil sections within the core is made of hardbaked photoresist. Alternatively, the entire insulation surrounding the coil sections within the core, in addition to the apex region, can be formed of inorganic nonferromagnetic material, further reducing pole tip protrusion. The transducer has SiO rather than alumina in an undercoat layer joining the wafer substrate and the thin film layers of the transducer. SiO may also replace alumina in other areas, such as a piggyback layer joining the inductive transducer with a magnetoresistive transducer.

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San Jose, CA, United States of America

Kenneth R Young