Cascade Microtech, Inc.

Other

Formfactor Beaverton, Inc.

Cascase Microtech, Inc.

Kenneth R Smith

Paul A Tervo

K Reed Gleason

Martin J Koxxy

Reed Gleason

Michael A Bayne

Randy J Schwindt

Warren K Harwood

Richard H Warner

Timothy E Lesher

Mike Bayne

Eric W Strid

Clarence E Cowan

Mike P Dauphinais

Koby L Duckworth

Mike Jolley

Peter Hanaway

Michael K Jolley

Peter Douglas Andrews

Victoria Van Syckel

Richard Lynn Campbell

Roger Hayward

Michael Jolley

Kooho Jung

Jeffrey A Williams

Laura L Spargur

Adam Pliska

Daniel M Bock

A grease gun mounting assembly for mounting a grease gun to a piece of equipment requiring routine greasing includes a connector, which has engaged thereto a first tube and a second tube with the first tube and the second tube being substantially parallel. The first tube is sized for insertion of a grease gun into an upper end thereof. The second tube is sized for insertion of a hose extending from the grease gun. The connector is engageable to an object, such as a piece of equipment requiring routine greasing, so that the first tube and the second tube are selectively engageable to the object. The grease gun and the hose can be inserted into the first tube and the second tube, respectively, for mounting the grease gun and the hose to the object.

Grease gun mounting assembly

The contacts of a probing apparatus are elastically supported on a replaceable coupon and electrically interconnected with conductors on a membrane or a space transformer.

Method of electrically contacting a bond pad of a device under test with a probe

Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.

Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same

Systems and methods for testing a device under test (DUT) that includes a low power output driver. The methods include providing an input signal to the DUT. The low power output driver is configured to generate a data signal responsive to receipt of the input signal by the DUT and provide the data signal to a signal analyzer via a data signal transmission line. The methods further include determining an expected data signal to be received from the low power output driver and charging at least a portion of the data signal transmission line with a co-drive output signal that is based, at least in part, on the expected data signal. The methods further include receiving a composite data signal with the signal analyzer. The systems include probe heads with a plurality of data signal transmission lines and a plurality of co-drive conductors.

Systems and methods for testing electronic devices that include low power output drivers

Method of replacing an existing contact of a wafer probing assembly

High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same. The high frequency interconnect structures include a plurality of dielectric waveguides and are configured to communicatively connect a plurality of transmitters with a plurality of receivers and to convey a plurality of signals therebetween. The plurality of signals may include a plurality of electromagnetic waves and may have a frequency of at least 200 GHz. The high frequency interconnect structures further may be configured to decrease a potential for crosstalk between a first signal that is conveyed by a first dielectric waveguide of the plurality of dielectric waveguides and a second signal that is conveyed by a second dielectric waveguide of the plurality of dielectric waveguides, such as through control of a passband of the first dielectric waveguide relative to the second dielectric waveguide and/or the use of a crosstalk mitigation structure.

High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same

A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

Membrane probing method using improved contact

Replaceable coupon for a probing apparatus

A weatherproof power inlet box and mating plug wherein the inlet box and mating plug are asymmetrical, positively latched and include more robust elements and a visual indicator of the status of the interconnect. Also included is a thermostat that trips to prevent overheating.

Weatherproof connector

A membrane probing assembly includes a support element having an incompressible forward support tiltably coupled to a rearward base and a membrane assembly, formed of polyimide layers, with its central region interconnected to the support by an elastomeric layer. Flexible traces form data/signal lines to contacts on the central region. Each contact comprises a rigid beam and a bump located in off-centered location on the beam, which bump includes a contacting portion. After initial touchdown of these contacting portions, further over-travel of the pads causes each beam to independently tilt locally so that different portions of each beam move different distances relative to the support thus driving each contact into lateral scrubbing movement across the pad thereby clearing away oxide buildup. The elastomeric member backed by the incompressible support ensures sufficient scrub pressure and reliable tilt recovery of each contact without mechanical straining of the beam. In an alternative embodiment, the contacts comprise conductive beams each supported on a loose U-shaped flap formed in the membrane assembly where each flap and beam is tiltably supported in inclined position by an elastomeric hub interposed between the flap and support.

Membrane probing structure with laterally scrubbing contacts

In a membrane probing apparatus, the impedance of the interface between coaxial cables connected to the test instrumentation and the membrane supported co-planar waveguide that conductively connects to the probe's contacts is optimized by eliminating a ground plane in the interface board.

Probing apparatus with impedance optimized interface

A method of probing an electrical device using a membrane probing system having an improved contact. A membrane probe forms a contact having a ridge with a pair of inclined surfaces defining an acute angle such that, when pressed into an electrical pad of a device to be tested, the ridge penetrates into the electrical pad, shearing away any oxide on the surface of the pad. The device may then be tested.

A bowsprit for a sailing vessel having a deck and a hull. A supporting member of the bowsprit has first and second opposing ends and is pivotably attachable to the deck such that the opposing ends of the supporting member extend outwardly past the hull. First and second movable members of the bowsprit are joined at an apex. First and second movable members are for disposition substantially adjacent to respective outer sides of the sailing vessel such that the apex is forward of the vessel and the first and second movable members are supported by and are slidable over the supporting member.

Retractable bowsprit for a sailing vessel

Growing community of inventors

Beaverton, OR, United States of America

Kenneth R Smith