Minnesota Mining and Manufacturing Company

Kenneth R Paulson

Nang T Tran

James R Gilbert

Derrick P Grimmer

William A Hendrickson

Robert W Wilson

Jack L Evans

Bruce A Sventek

The growth of a phosphor layer deposited on a patterned substrate containing a multiplicity of recessed ridges of triangular cross section can be controlled by tailoring the geometry of the recessed ridge structures. During the deposition process, little or no phosphor deposition occurs on the recessed ridge structures, and cracks are formed which separate the otherwise uniformly growing phosphor which is present in other regions of the patterned substrate where more substantial phosphor deposition occurs.

Process for forming a phosphor

A pixelized phosphor screen having an array of pixelized phosphors on a support which are separated a width of from greater than 0.0 to 5.0 microns. In order to produce the phosphor screen, phosphor is deposited on a support and then exposed to radiation to create an array of pixelized phosphors separated by slots. The resulting slots between the pixelized phosphors are then filled in with additional phosphor material such that the width between the pixelized phosphors is from greater than 0.0 to 5.0 microns.

Pixelized phosphor

A process for forming a phosphor comprising the steps of:

Process for forming a radiation detector

A process for fabricating a pixelized phosphor having a space between the pixels in the range of about 0.5-25 microns, the process comprising the steps of:

Method for fabricating pixelized phosphors

Semiconductor layer and conductive layer formed on a flexible substrate, divided into individual devices and interconnected with one another in series by interconnection layers and penetrating terminals.

Interconnected semiconductor devices

Method for fabricating an interconnected array of semiconductor devices

A photoconductive assembly comprising a conductive substrate, a photoconductive layer and a topcoat comprised of a cured film-forming silicone polymer. The topcoat has a thickness of between 5 and 300 nm and a melting point above 100.degree. C.

Growing community of inventors

Oakdale, MN, United States of America

Kenneth R Paulson