General Electric Company

Sabic Innovative Plastics IP B.v.

General Electric Corporation Gmbh

Other

Kenneth Paul Zarnoch

Gary William Yeager

Hua Guo

Michael Alan Vallance

Prameela Susarla

John Austin Rude

Charles Dominic Iacovangelo

John Robert Campbell

Amy Rene Freshour

Glen David Merfeld

Bryan Duffey

Renato Guida

Erich Otto Teutsch

Herbert Shin-I Chao

Michael Joseph O'Brien

James Wilson Rose

Steven William Webb

Robert Puyenbroek

Alan Joseph Oshinski

Gary John Thumann

Joop Birsak

Manuel Cavazos

Franciscus Johannes Maria Van Beek

Charles Edward Baumgartner

Wendy Wenling Lin

Qiwei Lu

Adrianus J F M Braat

Juraj Liska

Scott Michael Miller

Donald Clyle Rollen

Hugo Gerard Eduard Ingelbrecht

Narsi Devanathan

Carlyle S Herrick

Scott Alan Lane

Guillermo Daniel Zappi

David Peter Reis

Christian Andrew Huntley

Timothy W Austill

Benny Ezekiel David

Dana Ray Swalla

Herb Chao

David Parrillo

Laura Liou

Benny David

Hannah Rice James

Hugo Gerard Edward Ingelbrecht

Qiwei Liu

A method of making a master cure tool for applying a texture to an aerodynamic surface includes the steps of: providing a foil which is metallic and has a textured surface; applying the foil to a forming surface of a rigid forming tool which is compound curved, and plastically deforming the foil to conform to the forming surface, so as to define a foil layer; annealing the foil layer using heat or a combination of heat and pressure; and bonding the foil layer to a support body, thereby defining the master cure tool.

Method of forming a cure tool and method of forming a textured surface using a cure tool

The present techniques provide electrochemical devices having enhanced electrodes with surfaces that facilitate operation, such as by formation of a porous nickel layer on an operative surface, particularly of the cathode. The porous metal layer increases the surface area of the electrode, which may result in increasing the efficiency of the electrochemical devices. The formation of the porous metal layer is performed in situ, that is, after the assembly of the electrodes into an electrochemical device. The in situ process offers a number of advantages, including the ability to protect the porous metal layer on the electrode surface from damage during assembly of the electrochemical device. The enhanced electrode and the method for its processing may be used in any number of electrochemical devices, and is particularly well suited for electrodes in an electrolyzer useful for splitting water into hydrogen and oxygen.

Methods and systems for in-situ electroplating of electrodes

A thermoset composition exhibiting reduced water absorption in the cured state includes an olefinically unsaturated monomer and a capped poly(arylene ether) prepared by the reaction of an uncapped poly(arylene ether) with an anhydride capping agent. The capped poly(arylene ether) is isolated and/or purified by methods that reduce the concentrations of polar impurities that contribute to water absorption by the cured composition.

Capped poly(arylene ether) composition and process

A curable composition includes an olefinically unsaturated monomer and a poly(arylene ether) having two polymerizable groups and an intrinsic viscosity of about 0.05 to about 0.30 deciliters per gram. The composition exhibits an improved combination of high flow during molding and high post-cure stiffness and impact strength. The composition is particularly useful for fabricating plastic-packaged electronic devices.

Functionalized poly(arylene ether) composition and method

A conductive thermosetting composition comprises a functionalized poly(arylene ether), an alkenyl aromatic monomer, an acryloyl monomer, and a conductive agent. After curing, the composition exhibits good stiffness, toughness, heat resistance, and conductivity, and it is useful in the fabrication of a variety of conductive components, including the bipolar plates of fuel cells.

Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom

An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition. The mixture, at about low temperature, may be solid or tack-free, or both solid and tack-free.

Curable encapsulant composition, device including same, and associated method

A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a phosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.

Flame-retardant thermoset composition, method, and article

A curable composition includes a functionalized poly(arylene ether) resin, an acryloyl monomer, and a metallophosphorus flame retardant. The composition exhibits an improved balance of properties such as toughness, flame retardance, heat-resistance, and moisture resistance. It is useful, for example, as an encapsulant for semiconductor products.

A curable composition includes a functionalized poly(arylene ether), an olefinically unsaturated monomer, about 0.2 to about 5 parts by weight of a curing initiator per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer, and about 0.005 to about 1 part by weight of a curing inhibitor per 100 parts by weight total of the functionalized poly(arylene ether) and the olefinically unsaturated monomer. The weight ratio of the curing initiator to the curing inhibitor is about 1.2:1 to about 50:1. The composition provides improved and reproducible flow during the early stages of molding without compromising curing time. The composition is useful for preparing plastic-packaged electronic devices.

Poly (arylene ether) composition and method

A high performance thermoplastic polymer composition having improved melt flow properties, comprising a thermoplastic polymer resin and a low intrinsic viscosity poly(arylene ether). Preferred thermoplastic polymers are poly(imide) polymers.

High performance thermoplastic compositions with improved melt flow properties

A conductive thermosetting composition comprises a functionalized poly(arylene ether), and alkenyl aromatic monomer, an acryloyl monomer, and a conductive agent. After curing, the composition exhibits good stiffness, toughness, heat resistance, and conductivity, and it is useful in the fabrication of a variety of conductive components, including the bipolar plates of fuel cells.

A curable resin composition including a poly(arylene ether), an allylic monomer, and an acryloyl monomer may be formulated as a powder. The resin composition exhibits improved toughness, and it is useful in thermoset processing applications where use of powdered resins is preferred.

Poly(arylene ether)-containing thermoset composition in powder form, method for the preparation thereof, and articles derived therefrom

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Scotia, NY, United States of America

Kenneth Paul Zarnoch