At&t Bell Laboratories

American Telephone & Telegraph Co., At&t Bell Laboratories

Kenneth P Moll

Tsvi Goldenberg

Lawrence Arnold Greenberg

Jonathan D Knepper

An apparatus is provided for use with a solderability testing machine to releasably engage a sample for immersion into a solder bath. The apparatus contains a pair of spring-loaded plates which serve to hold the sample so that only the desired portion of the sample may be dipped in the solder. The apparatus also carries a threaded, depth-controlling member which may be threadedly adjusted to precisely control the depth of immersion of the sample held by the holder into the sample bath.

Apparatus for holding samples during solderability testing

Disclosed is a method of forming strong bonds between gold spheres and contact pads on semiconductor devices and the resulting product. The spheres are formed by establishing ball bonds with wire bonding techniques and then severing the wire. The wire material is a gold alloy including palladium which forms a weakened portion above the ball bond so that the wire can be easily broken off.

Growing community of inventors

Philipsburg, PA, United States of America

Kenneth P Moll