Intel Corporation

Kenneth N Wong

Robert C Sundahl

Thomas Dory

Methods of forming a continuous seed layer in a high aspect via and its associated structures are described. Those methods comprise forming a recess in a substrate, forming a non-continuous metal layer within the recess, activating the non-continuous metal layer and a plurality of non-deposited regions within the recess, electrolessly depositing a seed layer on the activated non-continuous metal layer and the plurality of non-deposited regions within the recess, and electroplating a metal fill layer over the seed layer, to form a substantially void-free metal filled recess.

Deep via seed repair using electroless plating chemistry

An electrical assembly (, FIG.) is formed from two, interconnected circuit boards (). Conductive spacers () and a conductive material () are placed between complementary bond pads () on the circuit boards. The conductive spacers are formed from a material that maintains its mechanical integrity during the process of attaching the circuit boards. The conductive material is a solder or conductive adhesive used to mechanically attach the circuit boards. In addition, an insulating material () is inserted into an interface region () between the circuit boards. The insulating material provides additional mechanical connection between the circuit boards. In one embodiment, one circuit board () includes a glass panel that holds an array of organic light emitting diodes (OLEDs), and the other circuit board () is a ceramic circuit board. Together, the interconnected circuit board assembly () forms a portion of a flat panel display (, FIG.).

Method for manufacturing an interconnected circuit board assembly

An electrical assembly ( , FIG. ) is formed from two, interconnected circuit boards ( ). Conductive spacers ( ) and a conductive material ( ) are placed between complementary bond pads ( ) on the circuit boards. The conductive spacers are formed from a material that maintains its mechanical integrity during the process of attaching the circuit boards. The conductive material is a solder or conductive adhesive used to mechanically attach the circuit boards. In addition, an insulating material ( ) is inserted into an interface region ( ) between the circuit boards. The insulating material provides additional mechanical connection between the circuit boards. In one embodiment, one circuit board ( ) includes a glass panel that holds an array of organic light emitting diodes (OLEDs), and the other circuit board ( ) is a ceramic circuit board. Together, the interconnected circuit board assembly ( ) forms a portion of a flat panel display ( , FIG. ).

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Chandler, AZ, United States of America

Kenneth N Wong