General Electric Company

Kenneth Marsik

Rolf S Bergman

Rajasingh Schwartz Israel

Tianji Zhao

A magnetron sputtering device and method for applying an interference layer to a substrate includes a magnetron sputtering chamber (A) which houses a substrate carrying assembly (B). The substrate carrying assembly comprises a primary rotation table ( ), rotating about its central vertical axis ( ) and at least one secondary table ( ) mounted to an upper surface ( ) of the primary rotation table. Substrates ( ) are either horizontally or vertically loaded on to the secondary table. The substrates rotate about their symmetrical axis. First and second targets ( ) are housed by the chamber and are disposed on opposite sides of the chamber. The primary rotation table rotates the substrates between a position adjacent a first target where a layer having a low refractive index is applied to the substrates and a position adjacent a second target where a layer having a high refractive index is applied to the substrates.

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Parma, OH, United States of America

Kenneth Marsik