Honeywell G.m.b.h.

Honeywell International Inc.

Kenneth L Eichholz

Mark F Johnston

Eugene D Alfors

Wayne L Ehlers

Lawrence E Frazee

John S Patin

William D Lanyi

Bradley T Woods

A vane actuated drive mode sensor is generally composed of two primary components, including a drive mode sensor array and an actuator. The sensor array can be provided as a housing composed of a plurality of Hall Effect (HE) sensors, magnets and the electronics associated with the sensors. The actuator, also referred to as a vane, can be provided as a plate constructed from a magnetic material, such as, for example, ferrous steel, and can be provided with holes punched thereon at different places depending on the requirement of a user. The actuator can be connected to a user's driver and can slide on and/or within the housing.

Vane actuated magnetic drive mode sensor

A connector is made by cutting a continuous strip of conductive material to provide individual fingers that extend in a direction perpendicular to the length of the strip. The fingers are individually bent to offset their distal ends from their connective ends. The process defines bend lines on each of the fingers and then bends the fingers to offset their distal ends from their respective connective ends in directions perpendicular to the plane of the conductive strip and along its length. After appropriately bending each of the fingers, a nonconductive material is molded around the group of fingers. Following the molding operation, the connective ends of the fingers are severed from the uncut portion of the strip to singular an electrical connector from the continuous strip of connectors.

Electrical connector with different lead arrangements at its opposite

A method is described for manufacturing a plurality of proximity sensors which are attached to a printed circuit board during the manufacturing steps and subsequently severed from the printed circuit board by shearing. Each of the proximity sensors comprises a core and coil assembly, a plurality of electronic components and an electrical connector. These components of each of the proximity sensors is encapsulated during an overmolding process and the encapsulations are removed from the printed circuit board by a shearing step. Each of the encapsulations can be inserted into a cylindrical housing.

Method for manufacturing an overmolded sensor

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Freeport, IL, United States of America

Kenneth L Eichholz