Autosplice, Inc.

Kenneth Krone

Robert Martin Bogursky

Leonid Foshansky

Craig Kennedy

Joseph J Lynch

Mark Saunders

Peter V Bellantoni

Frederick W Grabau

Apparatus and methods for filament crimping. The apparatus includes a filament crimp element. The filament crimp element includes a first set of cavities disposed at a spacing which creates a first set of features and a second set of cavities disposed at a spacing which creates a second set of features. The first and second set cavities are substantially opposite one another. The first set of features are adapted to be placed at least partially within the second set of cavities and the second set of features are adapted to be placed at least partially within the first set of cavities. Interlock features configured for cold welding are also included. Methods for the manufacture of the device are also disclosed. In addition, methods for automated placement and manufacture of assemblies using the crimp elements are also disclosed.

Shape memory alloy filament crimping element

Apparatus and methods for selectively providing or preventing access to areas, enclosed spaces or volumes, or for controlling the position of a pivot or hinge assembly. In one exemplary embodiment, the apparatus includes a selectively actuated or actuate-able hinge which is controlled at least in part by a shaped memory alloy (SMA) filament or filaments. Application of electrical current to the filament causes changes in the physical properties thereof, thereby allowing 'ratcheted' rotation of a portion of the hinge relative to other portions. In one variant, the hinge can be remotely operated, such as via wireless or wireline communication with a remote entity such as a computer or smartphone.

Selectively accessible container apparatus, hinge assembly with a shape memory alloy filament, and methods

A shielding apparatus useful in the attenuation of electronic noise or spurious electric signals is disclosed. In one embodiment, the shielding apparatus is encapsulated with an electronic component such as an integrated circuit. At least parts of the apparatus are formed using a selective metal deposition process (e.g., electroforming) that increases manufacturing efficiency and provides enhanced mechanical and structural features, as well as reduced cost. In another embodiment, the shielding apparatus comprises an array. Methods of manufacturing and utilizing the shielding apparatus are also disclosed.

Electronic shielding apparatus and methods

Upper and lower planar circuit boards are connected in spaced apart parallel relationship by a plurality of contacts each made of a conductive pin, insulative collar and solder ball. The upper ends of the pins are inserted in plated though holes in the upper circuit board and soldered thereto by wave soldering or re-flow. The pins have shoulders to establish the penetration of the pins into the upper circuit board. The lower ends of the pins are bonded to conductive pads on the lower circuit board via the solder balls that are maintained in substantially spherical configuration by the insulative collars and accommodate variations in board co-planarity or pin length. Where the lower ends of the pins do not contact their corresponding conductive pads the volume of solder in the solder balls allows reliable fillet solder joints to be formed.

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San Diego, CA, United States of America

Kenneth Krone