Amkor Technology, Inc.

Kenneth Kaskoun

Jeffrey Alan Miks

Paul Robert Hoffman

Vincent DiCaprio

Donald Craig Foster

Markus K Liebhard

Frederic Bertholio

John Armando Miranda

A semiconductor package for a semiconductor chip, e.g., a memory chip, is disclosed. The semiconductor package includes a substrate having a generally rectangular perimeter with four sidewalls and a chamfer between adjacent first and second ones of the sidewalls. The memory chip is electrically coupled contacts provided on an opposite surface of the substrate. The contacts are in a row along only the one sidewall of the substrate. A body of a plastic encapsulant covers the first surface of the substrate, the memory chip, and at least two of the sidewalls of the package. The entire perimeter of the substrate, including all four sidewalls and the chamfer, are covered by the plastic encapsulant. Alternatively, only two or three of the sidewalls are covered by the plastic encapsulant, with the other sidewall(s) being exposed and vertically coplanar with a respective sidewall of the plastic encapsulant.

Semiconductor memory card

A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.

Lead-frame method and assembly for interconnecting circuits within a circuit module

A lead-frame connector and circuit module assembly allows fabrication of a pin-connector type circuit module without a circuit board substrate and discrete connector. One or more integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. Connector pins formed on an extension of the lead-frame assembly provide an electrical interface to a mating connector without requiring a separate connector mounted on a substrate. An extension of the lead-frame assembly out of the circuit interconnect plane provides a multi-row pin connector in applications where a multi-row connector is needed.

Lead-frame connector and circuit module assembly

Alternative methods for making memory cards for computers and such eliminate a need for a separate external housing and a separate chip encapsulation step and enable more memory to be packaged in a same-sized card. One of said methods includes providing a substrate having opposite first and second surfaces with a memory chip mounted on and in electrical connection with a first surface of said substrate. Said second surface of said substrate is temporarily attached to a first surface of a flat carrier sheet, e.g., an adhesive tape. In one embodiment, a mold having a cavity therein is placed on said first surface of said carrier sheet such that said chip and said first surface of said substrate are enclosed in said cavity between said mold and said carrier sheet. A fluid plastic is introduced into said cavity and cured to encapsulate said chip and at least said first surface of said substrate in a protective, monolithic body of hardened plastic. A completed card is then detached from said carrier sheet.

Growing community of inventors

Phoenix, AZ, United States of America

Kenneth Kaskoun