Motorola Corporation

Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.

Kenneth Kaskoun

James L Rutledge

James Jen-Ho Wang

Erik Jung

Werner Budweiser

A substrate ( ) includes a conductive layer ( ) which is non-wettable by solder. A solder receiving stud ( ) is formed on the conductive layer, preferably by plating. If used for transferring solder, a solder bump ( ) is selectively formed on the solder receiving stud since the surrounding conductive layer is not wettable by the solder. A receiving substrate, such as a semiconductor device ( ), is aligned with the substrate. The solder bump is heated to a liquidus state and the solder bump makes physical contact with a solder accepting stud ( ) of the receiving substrate. Because the area of the solder accepting stud is larger than the area of the corresponding stud on the transfer substrate, the majority of the solder will transfer to the receiving substrate upon separation. Alternatively, the device could itself already have bumps formed thereon, in which case an unbumped substrate is used to test the device, and solder remains on the device upon separation.

Method for transfering solder to a device and/or testing the device

A test substrate (30) including a plurality of solder bumps (38) is used to test a die (10) which can be used as either a wire-bonded device or a flip-chip device. Die (10) includes test pads (14) which are redundant electrical connections to bond pads (12). The solder bumps make contact with the test pads of the device during testing. On separating the test substrate and die, the bumps remain on the test substrate if the die is to be wire bonded, or are transferred to the die if the die is to be flip-chip mounted to a next-level package substrate. Whether the bumps are transferred or not is determined by the relative areas of the solder receiving pads/studs (26 and 36) on the test substrate die. Common process flows and even die layouts can be used for the two different device types, thereby saving manufacturing and design costs.

Method for testing a semiconductor device and semiconductor device

A first pattern of bumps and a second pattern of bumps are formed on a substrate (10) with bumps (14,15). During a transfer process, only the bumps (14) of the first pattern of bumps are transferred to pad extensions (20) of a device (17). The bumps (15) of the second pattern of bumps are not affected by this process and can be later transferred to a second device.

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Berlin, Germany

Kenneth Kaskoun