International Business Machines Corporation

Globalfoundries Inc.

Kenneth Joseph Goodnow

Sebastian Theodore Ventrone

Clarence Rosser Ogilvie

Peter Albert Twombly

Stephen Gerard Shuma

Keith Robert Williams

Wilbur David Pricer

Kerry Bernstein

Charles S Woodruff

Serafino Bueti

Alvar Antonio Dean

Christopher B Reynolds

Todd Edwin Leonard

Gregory John Mann

Jason Michael Norman

Paul Steven Zuchowski

Jack Robert Smith

Adam J Courchesne

Scott Whitney Gould

Michel S Michail

Claude Louis Bertin

Douglas Willard Stout

Mark Steven Styduhar

Oscar Conrad Strohacker

Riyon W Harding

William R Tonti

Peter Anthony Sandon

Patrick Edward Perry

Corey Kenneth Barrows

Stanley B Stanski

Scott T Vento

John Maxwell Cohn

Francis A Kampf

John Sargis, Jr

Jonathan P Ebbers

Andrew S Wienick

Edward J Nowak

Joseph Andrew Iadanza

Charles Joseph Masenas

Douglas Wayne Kemerer

Suzanne Granato

Stephen William Mahin

Rafael Blanco

Nitin Sharma

Kyle E Schneider

Eze Kamanu

Kai D Feng

Michael Richard Ouellette

George Maria Braceras

Janak G Patel

Marc Raymond Faucher

Paul T Gutwin

Peter Joel Jenkins

Grant L Clarke, Jr

Kenneth Torino

John W Goetz

Gary R Doyle

Dana J Thygesen

Dana John Thygesen

William Robert Patrick Tonti

Sabastian Theodore Ventrone

Janak Ghanshyambhai Patel

Peter A Twembly

Ramnath Ravindran

Paul S Zuchewski

Clarence R Ogilvis

Clarence R Ogilvié

Christ Pher B Reynolds

John S Adams

An electrically conducting, vertically displacing microelectromechanical system (MEMS) is formed on a first integrated circuit chip. The first integrated circuit chip is physically connected to a three-dimensional packaging structure. The three-dimensional packaging structure maintains a fixed distance between the first integrated circuit chip and a second integrated circuit chip. A control circuit is operatively connected to the MEMS. The control circuit directs movement of the MEMS between a first position and a second position. The MEMS makes contact with a contact pad on the second integrated circuit chip when it is in the second position forming a conductive path and providing electrical communication between the first integrated circuit chip and the second integrated circuit chip. The MEMS avoids making contact with the contact pad on the second integrated circuit chip when it is in the first position.

Three-dimensional inter-chip contact through vertical displacement MEMS

A structure and method of using the structure. The structure including an integrated circuit chip having a set of micro-channels; an electro-rheological coolant fluid filling the micro-channels; first and second parallel channel electrodes on opposite sides of at least one micro-channel, the first channel electrode connected to an output of an auto-compensating temperature control circuit, the second channel electrode connected to ground; the auto-compensating temperature control circuit comprising a temperature stable current source connected between a positive voltage rail and the output and having a temperature sensitive circuit connected between ground and the output, a leakage current of the temperature stable current source being essentially insensitive to temperature and a leakage current of the temperature sensitive circuit increasing with temperature.

Auto-compensating temperature valve controller for electro-rheological fluid micro-channel cooled integrated circuit

A reactive metal optical security device for implementation in an optical network and/or system to provide a mechanism for disrupting the optical network and/or system. The security device includes a mirror comprising a reactive metal stack and configured to reflect an optical signal and receive an electrical signal. The security device further includes a semiconductor chip configured to send the electrical signal to the mirror.

Reactive metal optical security device and methods of fabrication and use

Structures and methods for self-powered devices are disclosed herein. Specifically, disclosed herein is a stacked, three-dimensional integrated circuit including a power generation die including a power source. The integrated circuit also includes a functional system die including one or more functional components that are powered by power generated by the power source. The power generation die and the functional system die are stacked in a three-dimensional structure.

Three-dimensional chip stack for self-powered integrated circuit

An integrated circuit chip having micro-channels formed in multiple regions of the integrated circuit chip and a method of cooling the integrated circuit chip. The method includes for any region of the multiple regions, allowing a coolant to flow through micro-channels of the region only when a temperature of the region exceed a first specified temperature and blocking the coolant from flowing through the micro-channels of the region when a temperature of the region is below a second specified temperature.

Electro-rheological micro-channel anisotropic cooled integrated circuits and methods thereof

Localized logic regions of a circuit include a local comparator electrically connected to a local resistive voltage circuit, to a local resistive ground circuit, and to a local register structure. The local comparator supplies a clock pulse to the local register structures when the local reference voltage is below a local voltage threshold. Activity in the local combinatorial logic structure causes the local reference voltage to drop below the local reference voltage independently of changes in the global reference voltage causing the comparator to output the clock pulse (with sufficient delay to allow the logic results to be stored in the registers only after setup times have been met in the local logic devices). This eliminates the need for a clock distribution tree, thereby saving power when there is no activity in the local combinatorial logic structure.

Inactivity triggered self clocking logic family

Systems and methods for selectively utilizing secondary power sources during peak power times are provided for. The method includes receiving a notification of a peak power time, and discontinuing use of a primary power supply and beginning use of a secondary power supply based upon the notification.

Secondary power utilization during peak power times

A MEMS component is monitored to determine its status. Sensors are deployed to sense the MEMS component and produce detection signals that are analyzed to determine the MEMS component state. An indicator device alerts a user of the status, particularly if the MEMS component has failed. Additionally, the MEMS component monitoring system may be practiced as a design structure encoded on computer readable storage media as part of a circuit design system.

Microelectromechanical structure (MEMS) monitoring

An integrated circuit (IC) including a warranty and enforcement system, and a related design structure and HDL design structure are disclosed. In one embodiment, an IC includes a parameter obtainer for obtaining a value of a parameter of the IC; a warranty data storage system for storing warranty limit data regarding the IC; a comparator for determining whether a warranty limit has been exceeded by comparing the value of the parameter to a corresponding warranty limit; and an action taker for taking a prescribed action in response to the warranty limit being exceeded.

Warranty monitoring and enforcement for integrated circuit and related design structure

Structures and methods are provided for performing non-destructive and secure disablement of integrated circuit (IC) functionality. A structure for enabling non-destructive and secure disablement and re-enablement of the IC includes a micro-electrical mechanical structure (MEMS) initially set to a chip enable state. The structure also includes an activation circuit operable to set the MEMS device to an error state based on a detected predetermined condition of the IC. The IC is disabled when the MEMS device is in the error state.

Switch to perform non-destructive and secure disablement of IC functionality utilizing MEMS and method thereof

A method configures a plurality of circuit elements for execution of an application in a first configuration. The method monitors the execution of the application on the plurality of circuit elements to produce monitoring information, using a computerized device, and stores the monitoring information in a storage structure. The method selectively communicates the monitoring information to an external element separate from the computerized device. The external element transforms the first configuration into a second configuration based on the monitoring information. The computerized device receives the second configuration from the external element and reconfigures the plurality of elements into the second configuration.

Dynamically reconfigurable self-monitoring circuit

A design structure including universal peripheral processor architecture on an integrated circuit (IC) includes a first data bus and a second data bus communicating with first and second ternary content addressable memory (TCAM) devices configured as state machines. First and second processors are coupled to the first bus interface logic and the second bus interface logic. First and second data storage devices communicate with the first and second processors and are coupled to the first and second data buses and communicate with each other. The TCAM devices are configured as state machines and are coupled to and adapted to interface with the processors, the data storage devices, and the bus interface logic using predefined protocols.

Structure for hardware assisted bus state transition circuit using content addressable memories

The invention generally relates to the utilization of electric power, and more particularly to systems and methods for selectively utilizing secondary power sources during peak power times. A method includes receiving a notification of a peak power time, and discontinuing use of a primary power supply and beginning use of a secondary power supply based upon the notification.

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Essex Junction, VT, United States of America

Kenneth Joseph Goodnow