Dialight Corporation

Kenneth Jenkins

Samual David Boege

Kevin A Hebborn

Anthony Verdes

John Patrick Peck

Klaus Oesterheld

David Weimer

Jason DiPasquale

William S Leib, Iii

Richard H Fetterly

Virginia Merriam

Christian Vorrius

William S Leib

William S Iii Leib

The present disclosure is directed to examples of housing for a luminaire. In one example, the housing includes a bioplastic base formed to receive a light emitting diode and a driver and a lens coupled to the bioplastic base. The bioplastic base may include a bioplastic and is formed with a non-biodegradable or a biodegradable plastic.

Polymeric materials for use with high power industrial luminaires

The present disclosure is directed to examples of a single modular heat spreader piece. In one example, the single modular heat spreader piece includes a body portion, wherein the body portion comprises a curved outer surface and a flange member coupled to a first side of the body portion, wherein the flange member has a curved outer edge, a connection member coupled to a second side of the body portion, wherein the second side of the body portion is opposite the first side, and a heat spreader member coupled to the second side of the body portion and on an opposite end of the body portion from the connection member.

Luminaires with modular heat spreader panels

The present disclosure provides a method for powering a light fixture to provide a constant light output. In one embodiment, the method includes providing a current to one or more light emitting diodes (LEDs), monitoring an external ambient temperature and increasing the current to the one or more LEDs as the external ambient temperature rises to maintain the constant light output.

High ambient temperature LED luminaire with thermal compensation circuitry

The present disclosure is directed to a light emitting diode (LED) light module. In one embodiment, the LED light module includes a plurality of light sections and a plurality of open sections formed by a plurality of heat sink fins between the plurality of light sections, wherein each one of the plurality of light sections is adjacent to two different light sections of the plurality of light sections.

LED lighting apparatus having a plurality of light emitting module sections interlocked in a circular fashion

The present invention is directed to a surface mount circuit board indicator. In one embodiment the surface mount circuit board indicator includes a printed circuit board (PCB) having at least one light emitting diode (LED) die, one or more traces and at least one lens, a housing comprising at least one opening on a side along a perimeter of the housing, wherein the PCB is coupled to the housing such that a light output surface of the at least one LED die faces a same direction as the at least one opening and at least one alignment pin coupled to the housing.

Surface mount circuit board indicator

LED lighting apparatus with an open frame network of light modules

The present disclosure is directed to a method for potting an electrical module. In one embodiment, the method includes placing the electrical component in a potting mold, wherein the potting mold comprises an interior topology that matches a topology of one or more components of the electrical module, filling the potting mold with a potting compound and curing the potting compound over the electrical module.

Growing community of inventors

Port Monmouth, NJ, United States of America

Kenneth Jenkins