Hamilton Sundstrand Corporation

Kenneth J Trotman

Jay W Kokas

Kerry R Querns

David Perley

Rachel Farner

Alexander Trotman

Rachel Welsh

Jason C Duffy

Michael Maynard

Charles V DeSantis

Luke T Orsini

Shun-Tien Lin

An electronic assembly includes one or more electronic components, and an enclosure in which the one or more electronic components are located. The enclosure includes a vertically top surface, a vertically bottom surface, and a plurality of side portions extending between the top surface and the bottom surface. A cooling arrangement for thermal management of the one or more electronic components includes a cooling airflow inlet to admit a cooling airflow into the enclosure, a cooling airflow outlet to exhaust the cooling airflow from the enclosure, and one or more cooling pathways between the cooling airflow inlet and the cooling airflow outlet. One or more removable covers are positioned over the cooling airflow inlet to allow for airflow ingress into the cooling airflow inlet, while preventing impingement of debris into the cooling airflow inlet.

Debris-resistant cooling path

A chassis includes top rails extending along a top side of the chassis, bottom rails extending along a bottom side of the chassis, a fluid inlet connected to the chassis that is configured to receive a thermal transfer fluid, and a fluid outlet connected to the chassis that is configured to discharge the thermal transfer fluid. The chassis further includes a thermal transfer fluid path extending between and fluidly coupled to the fluid inlet and the fluid outlet, wherein the thermal transfer fluid is configured to flow through the thermal transfer fluid path, and wherein the thermal transfer fluid path extends in a serpentine pattern through at least one of the top rails and through at least one of the bottom rails.

Chassis with thermal transfer fluid path

A vent/drain cover for an electronics enclosure includes a cover body defining an axis and a surface with a first wall protruding from the surface in a direction and a second wall protruding from the surface in the same direction but displaced radially from the first wall. The first wall has a first channel formed therein that is defined by a portion of the first wall that does not extend as far from the surface as the balance of the first wall. The second wall has a second channel defined by a portion of the second wall that does not extend as far from the surface as the balance of the second wall, the first channel being circumferentially offset from the second channel. Electronics enclosures and methods of venting electronics assemblies are also described.

Methods of protecting vent/drain features in electronic assemblies

A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.

Component vertical mounting

Vent/drain covers, vented/drained enclosures, and methods of protecting vent/drain features in electronic assemblies

An integrated adapter configured to hold two first circuit card assemblies in a larger second circuit card assembly space includes a thermally-conductive frame and two vertical thermally-conductive guide rails in the inboard region of the frame front. A channel is formed in each of the two guide rails, extending from the guide rail top to the guide rail bottom on the respective outboard side, thereby defining a front rail and a back rail, each configured to receive and support an edge of a first circuit card assembly, and the frame is configured to be attached to a second circuit card assembly, thereby forming an integrated adapter circuit card. Various circuit card sizes can be adapted for use, including supporting two 3U circuit cards in a 6U circuit card space. A method of making the integrated adapter is also disclosed.

Integrated card-guide adapter heat sink

An apparatus includes a heat sink and a post that supports the heat sink that is monolithically formed with the heat sink. The apparatus can further include a printed wiring board attached to a top side of the heat sink with electronic components attached to the printed wiring board, a plurality of posts integrated into a bottom side of the heat sink and extending outwards from the heat sink, wherein the heat sink and the plurality of posts are monolithically formed, and a heat pipe attached to the bottom side of the heat sink with a first end near an electronic component and a second end near one of the plurality of posts.

Heat pipe embedded heat sink with integrated posts

An active input/output connector includes a first printed circuit board and a second printed circuit board enclosed within a housing. A first plug is in electronic communication with the first printed circuit board. A second plug is in electronic communication with the second printed circuit board. The first and second printed circuit boards are connected for communication of sensor signals from the first plug to the second plug.

Integrated input/output connector

An enclosure includes an enclosure body having an enclosure cavity, the enclosure body formed from a first material, and at least one ballistic tolerant plate disposed within the enclosure cavity to form a plurality of channel enclosures within the enclosure cavity, the at least one ballistic tolerant plate formed from a ballistic tolerant material.

Lightweight ballistic enclosure

An apparatus includes a printed wiring board, a post that supports the printed wiring board, and a heat pipe on the printed wiring board with a first end positioned near an electronic component attached to the printed wiring board and a second end positioned near the post.

PWB cooling system with heat dissipation through posts

An electronic component and cooling system has a printed wiring board, which is planar. An electrical component is mounted on one side of the planar surface of the printed wiring board. A hood is positioned outwardly of the electronic component. Legs on the hood extend to the printed wiring board, and form an inner surface that is positioned away from the one side relative to the electrical component. A chassis has posts connected to the printed wiring board and on an opposed side of the planar surface of the printed wiring board from the electrical component. The chassis extends to a remote portion, beyond the printed wiring board. A heat pipe is generally elongate and positioned on an opposed side of the hood from the electrical component. The heat pipe extends to the remote portion of the chassis to transfer heat from the hood to the chassis.

Electronic component cooling hood and heat pipe

A removable tool includes a toe, a clevis, and a handle. The toe is configured to be insertable into and removable from an enclosure notch of a card guided computer enclosure. The clevis is configured to be insertable into and removable from a card hook of a circuit card assembly. The handle is for receiving force for inserting or extracting an array of circuit card assembly contacts into or out of an array of motherboard contacts, respectively.

Growing community of inventors

Granby, CT, United States of America

Kenneth J Trotman