International Business Machines Corporation

Globalfoundries U.S. 2 LLC

Kenneth F Latzko

John Ulrich Knickerbocker

Bing Dang

Bucknell Chapman Webb

Steven Lorenz Wright

S Jay Chey

Joana Sofia Branquinho Teresa Maria

Lavanya Turlapati

Daniel C Edelstein

Michael S Gordon

Michael A Gaynes

Qinghuang Lin

Sri Muthuthamby Sri-Jayantha

Roy Rongqing Yu

Robert L Wisnieff

Steven Alan Cordes

Vijayeshwar Das Khanna

Nancy C LaBianca

Peter Jerome Sorce

Aparna Prabhakar

Evan G Colgan

Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.

Microchip substance delivery devices

Microchip substance delivery devices having low-power electromechanical release mechanisms

The present disclosure relates to methods and devices for manufacturing a three-dimensional chip package. A method includes forming a linear groove on an alignment rail, attaching an alignment rod to the linear groove, forming alignment channels on a plurality of integrated circuit chips, and aligning the plurality of integrated circuit chips by stacking the plurality of integrated circuit chips along the alignment rail. Another method includes forming an alignment ridge on an alignment rail, forming alignment channels on a plurality of integrated circuit chips, and aligning the plurality of integrated circuit chips by stacking the plurality of integrated circuit chips along the alignment rail.

Alignment of integrated circuit chip stack

A method for detecting soft errors in an integrated circuit (IC) due to transient-particle emission, the IC comprising at least one chip and a substrate includes mixing an epoxy with a radioactive source to form a hot underfill (HUF); underfilling the chip with the HUF; sealing the underfilled chip; measuring a radioactivity of the HUF at an edge of the chip; measuring the radioactivity of the HUF on a test coupon; testing the IC for soft errors by determining a current radioactivity of the HUF at the time of testing based on the measured radioactivity; and after the expiration of a radioactive decay period of the radioactive source, using the IC in a computing device by a user.

SER testing for an IC chip using hot underfill

Growing community of inventors

Carmel, NY, United States of America

Kenneth F Latzko