Cooligy, Inc.

Leland Stanford Junior University

Toyota Motor Engineering & Manufacturing North America, Inc.

Northrop Grumman Systems Corporation

University of California

University of Connecticut

University of Oklahoma

Alliance for Sustainable Energy, LLC

Samsung Electronics Co., Ltd.

United States Department of Energy

Kenneth E Goodson

Thomas W Kenny

Juan G Santiago

Mark Munch

Shulin Zeng

James Gill Shook

David Corbin

Peng Zhou

Girish Upadhya

Mehdi Asheghi

Daniel J Laser

Linan Jiang

Thomas William Kenny, Jr

Chuan-Hua Chen

George Carl Everett, Jr

James C Mikkelsen

David E Huber

Jae-Mo Koo

Evelyn Ning-Yi Wang

Lian Zhang

Ercan Mehmet Dede

Feng Zhou

John A Starkovich

Edward M Silverman

Jesse B Tice

Mark McMaster

Hsiao-Hu Peng

Michael T Barako

Saroj Kumar Sahu

Daniel J Lenehan

Dave B Corbin

Richard A Herms

Xuejiao Hu

Amir Faghri

James Lovette

Ki Wook Jung

Hamidreza Shabgard

James W Palko

Sougata Hazra

Sreekant Narumanchi

Chi Zhang

Ercan Mehment Dede

Seunghyun Lee

Yongsung Kim

James Hom

David Mann

Eric Pop

H-s Philip Wong

Dolf Van Der Heide

Matthew Panzer

James Palko

Alexandros Terzis

Chiyui Ahn

Aditya Sood

James Horn

Scott Fong

Juan Suntiago

John J Kim

Christopher M Neumann

Robert C Chaplinsky

Roman Giglio

Bidzina Kekelia

Souvik Roy

Neda Seyedhassantehrani

Muhammad Shattique

Qianying Wu

A first aspect of this work relates to water harvesting in power plants. A water adsorbent material is driven through adsorption-desorption cycles using waste heat from a power plant to harvest water from ambient air. In a preferred embodiment, metal-organic-framework (MOF) powders are used as the water adsorbent material for this application. A second aspect of this work relates more generally to rapid adsorption-desorption cycling of MOFs for various applications.

Continuously-cycled water harvesting for dry cooling tower operated power plants

Disclosed herein are apparatus for a cooler device includes a manifold constructed at least partially of silicon oxide. The manifold includes an array of inlet channels and an array of outlet channels. Each inlet channel has a first depth. The array of outlet channels are interlaced with the array of inlet channels, Each outlet channel has a second depth that is larger than the first depth. Each of the array of outlet channels has a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels.

Systems for cooler devices and cooling manifolds

A heat sink apparatus having a pair of casings hinged in a clamshell arrangement and configured to contain a portion of an electric charging cable, the casings each having an inner space which contains a phase change material for absorbing heat generated during current flow through the electric charging cable.

Coaxial phase change material heat sink for electric charging cable

A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.

Heat flux micro coolers having multi-stepped features and fluid wicking

A charging cable apparatus having a connector, an electrically-conductive cable extending from the connector, the cable configured to be connectable to a charging station for receiving a charging current from the charging station, and having a heat pipe with a phase change section having a wicking structure, the wicking structure having a working fluid therein during operation for receiving heat generated during current flow within the cable. The charging cable apparatus may further have an external condensing surface in fluid communication with the phase change section of the heat pipe for accelerating condensation of evaporated working fluid. The charging cable apparatus may be connected to a charging station for charging an electric battery such as a battery of an electric vehicle.

Passively cooled high power electric cable, system and method

A method of etching features in a silicon wafer includes coating a top surface and a bottom surface of the silicon wafer with a mask layer having a lower etch rate than an etch rate of the silicon wafer, removing one or more portions of the mask layer to form a mask pattern in the mask layer on the top surface and the bottom surface of the silicon wafer, etching one or more top surface features into the top surface of the silicon wafer through the mask pattern to a depth plane located between the top surface and the bottom surface of the silicon wafer at a depth from the top surface, coating the top surface and the one or more top surface features with a metallic coating, and etching one or more bottom surface features into the bottom surface of the silicon wafer through the mask pattern to the target depth plane.

Method of etching microelectronic mechanical system features in a silicon wafer

A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: removing a template membrane from the MNW; infiltrating the MNW with a bonding material; placing the bonding material on the adjacent surface; bringing an adjacent surface into contact with a top surface of the MNW while the bonding material is bondable; and allowing the bonding material to cool and form a solid bond between the MNW and the adjacent surface. A thermally-conductive and mechanically-robust bonding method for attaching a metal nanowire (MNW) array to an adjacent surface includes the steps of: choosing a bonding material based on a desired bonding process; and without removing the MNW from a template membrane that fills an interstitial volume of the MNW, depositing the bonding material onto a tip of the MNW.

High-conductivity bonding of metal nanowire arrays

Embodiments of an evaporator chamber heat flux rectifier and thermal switch are provided. Some embodiments include an evaporator layer with a first thermally conductive surface, a wicking structure for facilitating evaporation of a fluid in the vapor chamber heat flux rectifier, and a condenser layer that includes a second thermally conductive surface. Some embodiments include a middle layer, where when heat is applied to the first thermally conductive surface, the vapor chamber heat flux rectifier operates as a thermal conductor. Some embodiments that operate as a thermal switch include a non-condensable gas reservoir that is coupled to the condenser layer. The non-condensable gas reservoir may store a non-condensable gas when a threshold heat flux is applied to the evaporator layer. The non-condensable gas provides thermal insulation between the evaporator layer and the condenser layer when the threshold heat flux is not applied to the evaporator layer.

Vapor chamber heat flux rectifier and thermal switch

Provided is a phase change memory device including a graphene layer inserted between a lower electrode into which heat flows and a phase change material layer, to prevent the heat from being diffused to an outside so as to efficiently transfer the heat to the phase change material layer, and a method of fabricating the phase change memory device. The phase change memory device includes a lower electrode; an insulating layer formed to enclose the lower electrode; a graphene layer formed on the lower electrode; a phase change material layer formed on the graphene layer and the insulating layer; and an upper electrode formed on the phase change material layer. Since a phase of the phase change material layer is changed at a small amount of driving current, the phase change memory device is fabricated to have a high driving speed and a high integration.

Graphene-inserted phase change memory device and method of fabricating the same

A closed loop cooling system and apparatus for controlling a fluid flow rate through the closed loop cooling system, the apparatus comprising a heat exchanger coupled to at least one heat generating device for removing waste heat from the heat generating device, at least one pump for circulating the fluid, a heat rejector for receiving the fluid, at least one fan for removing waste heat from the heat rejector, at least one temperature sensor coupled to the heat generating device to measure the temperature value of the at least one heat generating device, and a controller electrically coupled to the at least one pump, the at least one fan, and the at least one temperature sensor for receiving the temperature value to selectively control the fluid flow rate and the air flow rate, based on the temperature value.

Pump and fan control concepts in a cooling system

A system for cooling a heat source includes a fluid heat exchanger, a pump, a thermoelectric device and a heat rejector. The thermoelectric device includes a cooling portion and a heating portion. The heat rejector is configured to be in thermal contact with at least a portion of the heating portion of the thermoelectric device. The pump is coupled with the fluid heat exchanger and configured to pass a fluid therethrough. The thermoelectric device is configured along with the heat exchanger in the cooling system.

Cooling systems incorporating heat exchangers and thermoelectric layers

A thermal interface material includes a mechanically compliant vertically aligned nanofiber film and a binder material for joining the nanofibers of the film to the surfaces of two substrates. Preferably, the binder material comprises a non-hydrocarbon-based material such as a metallic eutectic with a melting temperature below a nanofiber thermal damage threshold temperature of the film. The film is grown on a substrate which is then bonded to another substrate by the binder material in an adhesion process that may include pressure and heat. Alternatively, the film may be released from the substrate to produce a stand-alone thermal tape which may later be placed between two substrates and bonded.

Composite thermal interface material including aligned nanofiber with low melting temperature binder

Growing community of inventors

Portola Valley, CA, United States of America

Kenneth E Goodson