Honeywell International Inc.

Honeywell G.m.b.h.

Kenneth E Gall

Brian John Marsh

James D Cook

Richard L Dale

Kundan L Malik

A pressure sensor apparatus is disclosed herein, which generally includes a sensor element, a flexible sensor diaphragm in intimate contact with the sensor element at all pressure levels and temperatures, and a package base and a package cover for hermetically sealing the sensor element and the flexible sensor diaphragm within a hermetically sealed sensor package to provide pressure sensor data thereof. The sensor element can be implemented as a quartz sense element to produce a SAW pressures sensor. The pressure sensor apparatus can be alternatively based on other sensing technologies, such as silicon piezoresistive, ceramic capacitive and others.

Pressure sensor apparatus and method

A sensor apparatus and method are disclosed herein. A base is generally located proximate to a cover. A sensor element (e.g., quartz, silicon, ceramic, and the like) can be located on the base, such that the cover and the base form a clearance between the cover and the base. The clearance can be configured such that when the cover is at its smallest dimension within the tolerance range thereof and the base is at its largest dimension within the tolerance range thereof there is a clearance between them. Additionally, a sensor diaphragm and a dimple can be incorporated into the cover, wherein the dimple is in intimate contact with the sensor element at all pressure levels and temperatures thereof.

Sensor slip fit apparatus and method

A diaphragm cover apparatus and method for a sensor are disclosed. A sensor cover is located proximate to a base. A dimple can be located centrally within the cover, wherein the dimple comprises a component that is separate from the sensor cover and diaphragm. The dimple contacts a sense element of the sensor. Additionally, a foil can be adapted for use in blocking air permeation through the sensor diaphragm, when the sensor experiences pressure. An over mold diaphragm is generally located as part of the sensor cover. The dimple itself comprises a highly polished surface to reduce stress concentrators from contacting the sense element. The dimple can be formed from materials such as stainless steel, ceramic and the like to optimize the performance of the sensor.

Sensor with molded sensor diaphragm cover

A sensor apparatus and method are disclosed herein, including a sensor element located on a base and a cover located proximate to the base. The cover generally includes a sensor diaphragm and a dimple that can form a part of the cover. A flanged area or flanged portion can also be connected to the bottom portion of the cover. The flanged area provides a surface for contacting a fixture to which the sensor apparatus attaches and holding the sensor apparatus to the fixture in a manner which prevents the sensor diaphragm from contacting the fixture and inducing errors during sensor operations thereof. The cover also can include a flanged or brim-shaped portion which is connected to and surrounds the bottom portion of the cover. The flanged portion can be positioned parallel to the sensor diaphragm.

Sensor top hat cover apparatus and method

A magnetically sensitive switch is provided with an electromagnetic interference shield molded within the housing of the switch. In one embodiment, the magnetically sensitive switch is a vane switch for use in an automobile ignition system. The electromagnetic interference shield is formed by appropriately bending a flat sheet at a plurality of bend lines to form a box-like structure. The box like structure has five surfaces and one or more connection legs extending from one of the surfaces. One surface of the box-like structure also serves as a potting dam when a potting material is deposited into the cavity formed by the five surfaces during the process by which internal components are potted within the cavity of the EMI shield. The vane switch also includes a magnet encapsulated within its housing structure and spaced apart from the magnetically sensitive device within the EMI shield by a predetermined gap. The gap is shaped and sized to permit a portion of a rotatable member to pass therethrough between the magnet and the magnetically sensitive device to affect the magnetic field approximate the device.

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Rock City, IL, United States of America

Kenneth E Gall