Motorola Corporation

Other

Kenneth E Cook

Allen David Hertz

David A Tribbey

John P Cheraso

Arthur L Baker

Kenneth R Warren

Paul M Bricketto

Jonathan Carr

A heat seal connector (100) includes a flexible substrate (105), interconnects (110) disposed thereon, and a parting agent (115) contiguous with the flexible substrate (105) for preventing the heat seal connector (100) from adhering to a heating platen (505) applied thereto, wherein the heating platen (505) does not include a parting agent for preventing the heat seal connector (100) from adhering to the healing platen (505). The heat seal connector (100) is bonded to first and second electronic circuits (415, 420) during application of the heating platen (505) such that the interconnects (110) electrically couple conductive pads (417) formed on the first electronic circuit (415) to corresponding conductive pads (425) formed on the second electronic circuit (420).

Heat seal connector with integral parting agent

An electronic device (100) comprises a first substrate (102) having a first circuit pattern disposed thereon which is selectively processed to provide pretinned connection pads (108, 116, 124, 132, 140) for connection to at least one electronic component (142) and a second circuit pattern disposed on a second substrate (104). The second circuit pattern disposed on the second substrate (104) is selectively processed to further provide pretinned connection pads (110, 118, 126) for connection to the first circuit pattern, and the second substrate (104) further has relief provided within a portion thereof to position the at least one electronic component (142) with respect to the pretinned connection pads (108, 116, 124, 132, 140) on the first circuit pattern. The pretinned connection pads (108, 116, 124, 132, 140, 110, 118, 126) are processed using a low residue fluxing agent to enable processing of the first (102) and second (104) substrates and the at least one electronic component (142) in a single operation through an envelope heating device without a requirement for cleaning after reflow.

Cardlike electronic device

A watercraft employs three or more supercavitating hydrofoils. The elements that connect the hydrofoils to the hull may flex to thus raise or lower the hydrofoils relative to the hull. The relative motion between the hydrofoils and the hull is dampened by shock absorbers or the like. A control system operated by the pilot may apply forces tending to raise or lower the hydrofoils relative to the hull. The stern hydrofoil is mounted on a support that also carries a power driven propeller and a rudder.

Watercraft with vertically movable hydrofoils

A connector (40) for insertion into a portable electronic device (30) provides testing, programming and power thereto. The portable electronic device (30) has a chassis (32) housed therein and further includes a battery cavity (35) with battery contacts (36) therein. The connector (40) has a distal end for contacting the chassis (32) through an access port (34) in the battery cavity (35). A proximal end of the connector (40) is adapted for connection to a cable. The connector (40) has a substrate (50) attached to a printed wire board (41), wherein the printed wire board (41) further comprises a first plurality of conductors (52) thereon for receiving data signals from the cable, and a second plurality of conductors (42) thereon for receiving power signals from the cable. A first plurality of contacts (48) are coupled to the first plurality of conductors (52) at the distal end of the connector (40) for contacting the chassis, and a second plurality of contacts (46) are coupled to the second plurality of conductors (42) at the distal end of the connector (40) for contacting the battery contacts.

Connector for providing programming, testing, and power signals

A method for solder deposition by the use of a laser (24), comprises the steps of applying a predetermined thickness of solder (6) to a substrate (2) including over a printed circuitry pattern (4) on the substrate, laser printing (24) to a reflow temperature the solder on the printed circuitry pattern, leaving an un-reflowed portion (9) and then removing (26) the un-reflowed portion of the substrate, leaving solidified solder (7) on the printed circuitry pattern of the substrate. Additionally, if desired, a part (12) having solder pads (14) can be placed on the solder (7) after tack media (13) is placed on the solder. Then the part (12) and substrate can be reflowed in an oven (34).

Growing community of inventors

Lake Worth, FL, United States of America

Kenneth E Cook