Qualcomm Incorporated

Kenneth Dubowski

Thomas Clark Bryan

Luverne Ray Peterson

Tin Tin Wee

Sreeker Dundigal

Stephen Knol

Mark Wayland

Scott Powers

Andrew Tohmc

Alvin Loke

Subrahmanya Pradeep Morusupalli

A semiconductor die including: a die-to-die interface including an input/output (I/O) circuitry area and an electrical contact area; wherein the electrical contact area includes an array of electrical contacts disposed on a side of the semiconductor die; and wherein the I/O circuitry area includes a plurality of drivers, each of the drivers coupled to at least one electrical contact in the electrical contact area, and a plurality of electrostatic discharge (ESD) protection devices, each of the ESD protection devices coupled to a respective driver, further wherein the I/O circuitry area and the electrical contact area are separated in a top-down view of the semiconductor die.

Die-to-die interface configuration and methods of use thereof

A die is provided having an unterminated endpoint that capacitively loads its input impedance with a capacitance from capacitor while acting as a receiving endpoint and that isolates its output impedance from the capacitance while acting as a transmitting endpoint.

Programmable pad capacitance for supporting bidirectional signaling from unterminated endpoints

A control circuit generates data signals and configuration commands that are provided to an interface circuit. The interface circuit includes a configuration circuit that generates configuration signals according to the configuration commands and a drive component that generates interface signals according to the data signals. The interface signals are generated with a drive characteristic determined according to the configuration signals applied to configuration devices that selectively activate a configuration of drive devices. A diagnostic circuit is coupled to the control circuit and the interface circuit and is configured to receive a test state indication and acquire a corresponding portion of the configuration signals. The diagnostic circuit compares the test state indication and the portion of the configuration signals to diagnose a stuck-at fault condition within a faulty configuration circuit and propagate a fault indication to the control circuit.

Cascaded test chain for stuck-at fault verification

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San Diego, CA, United States of America

Kenneth Dubowski