Intel Corporation

Other

Tahoe Research, Ltd.

Kenneth D Shoemaker

Pete D Vogt

Edward Thomas Grochowski

John B Halbert

Gary N Hammond

Donald B Alpert

Warren Morrow

Ivan Herrera Mejia

Johanna M Swan

Adel A Elsherbini

Telesphor Kamgaing

Georgios C Dogiamis

Sasha N Oster

Konrad K Lai

Ryan Donovan Wells

Nazar A Zaidi

Bruce L Fleming

Andre Schaefer

Kevin C Kahn

James Steven Burns

Erich Nolan Ewy

Kin-Yip Liu

Jin Kim

Joydeep Ray

Ned M Smith

Francesc Guim Bernat

Vinodh Gopal

Kshitij Arun Doshi

Shreekant S Thakkar

Blaise B Fanning

Rajesh Bhikhubhai Patel

Sridhar Lakshmanamurthy

Belliappa Manavattira Kuttanna

Ashish V Choubal

Sailesh Kottapalli

Sudarshan Kumar

Doron Orenstein

Lance E Hacking

Vivek Tiwari

David J Ayers

Ramana V Rachakonda

Uri C Weiser

Anil K Sabbavarapu

Suketu R Partiwala

Paul Fahey

Prashanth Kalluraya

Ahmad Zaidi

Anand B Pai

Tom E Wang

Millind Mital

Sami Yehia

Brian Toronyi

A stacked memory with interface providing offset interconnects. An embodiment of memory device includes a system element and a memory stack coupled with the system element, the memory stack including one or more memory die layers. Each memory die layer includes first face and a second face, the second face of each memory die layer including an interface for coupling data interface pins of the memory die layer with data interface pins of a first face of a coupled element. The interface of each memory die layer includes connections that provide an offset between each of the data interface pins of the memory die layer and a corresponding data interface pin of the data interface pins of the coupled element.

Stacked memory with interface providing offset interconnects

In one embodiment, a method includes: receiving, in an edge platform, a plurality of messages from a plurality of edge devices coupled to the edge platform, the plurality of messages comprising metadata including priority information and granularity information; extracting at least the priority information from the plurality of messages; storing the plurality of messages in entries of a pending request queue according to the priority information; selecting a first message stored in the pending request queue for delivery to a destination circuit; and sending a message header for the first message to the destination circuit via at least one interface circuit, the message header including the priority information, and thereafter sending a plurality of packets including payload information of the first message to the destination circuit via the at least one interface circuit. Other embodiments are described and claimed.

System, apparatus and method for adaptive peer-to-peer communication with edge platform

Embodiments of the invention include autonomous vehicles and mm-wave systems for communication between components. In an embodiment the vehicle includes an electronic control unit (ECU). The ECU may include a printed circuit board (PCB) and a CPU die packaged on a CPU packaging substrate. In an embodiment, the CPU packaging substrate is electrically coupled to the PCB. The ECU may also include an external predefined interface electrically coupled to the CPU die. In an embodiment, an active mm-wave interconnect may include a dielectric waveguide, and a first connector coupled to a first end of the dielectric waveguide. In an embodiment, the first connector comprises a first mm-wave engine, and the first connector is electrically coupled to the external predefined interface. Embodiments may also include a second connector coupled to a second end of the dielectric waveguide, wherein the second connector comprises a second mm-wave engine.

Mmwave dielectric waveguide interconnect topology for automotive applications

Embodiments include a waveguide bundle, a dielectric waveguide, and a vehicle. The waveguide bundle includes dielectric waveguides, where each dielectric waveguide has a dielectric core and a conductive coating around the dielectric core. The waveguide bundle also has a power delivery layer formed around the dielectric waveguides, and an insulating jacket enclosing the waveguide bundle. The waveguide bundle may also include the power deliver layer as a braided shield, where the braided shield provides at least one of a DC and an AC power line. The waveguide bundle may further have one of the dielectric waveguides provide a DC ground over their conductive coatings, where the AC power line does not use the braided shield as reference or ground. The waveguide bundle may include that the power delivery layer is separated from the dielectric waveguides by a braided shield, where the power delivery layer is a power delivery braided foil.

Mmwave waveguides featuring power-over-waveguide technology for automotive applications

A temperature difference between a first thermal sensor and a second thermal sensor on a first die is determined. The temperature difference is transmitted from the first die to a circuit on a second die. A temperature from a thermal sensor on the second die is determined. The temperature difference and the temperature from the thermal sensor are utilized on the second die to modify operational characteristics of one or more circuits on the second die.

Induced thermal gradients

An apparatus with an ultra low power architecture is described herein. The apparatus includes a first power supply rail, wherein a plurality of subsystems are to be powered by the first power supply rail. The apparatus also includes a second power supply rail, wherein a plurality of autonomous subsystems are to be powered by the power supply rail, wherein the second power supply rail is to be always on, always available, and low power.

Ultra low power architecture to support always on path to memory

An integrated circuit such as a SoC may indicate the critical battery status without powering-on a substantial portion including the host processing cores. The SoC may include a microcontroller, which may cause the critical battery status data to be stored in a static memory and the display unit may retrieve such data from the static memory to display a visual symbol on the screen. The other portions of the SoC such as the dynamic memory, system agent, media processors, and memory controller hubs may be powered-down while the critical battery status is displayed in the visual form on the screen.

Indicating critical battery status in mobile devices

A stacked memory allowing variance in device interconnects. An embodiment of a memory device includes a system element for the memory device, the system element including multiple pads, and a memory stack connected with the system element, the memory stack having one or more memory die layers, a connection of the system element and the memory stack including interconnects for connecting a first memory die layer and the plurality of pads of the system element. For a single memory die layer in the memory stack, a first subset of the plurality of pads is utilized for a first group of interconnects for the connection of the system element and the memory stack, and for two or more memory die layers, the first subset and an additional second subset of the plurality of pads are utilized for the first group of interconnects and a second group of interconnects for the connection of the system element and the memory stack.

Stacked memory allowing variance in device interconnects

Memory operations using system thermal sensor data. An embodiment of a memory device includes a memory stack including one or more coupled memory elements, and a logic chip coupled with the memory stack, the logic chip including a memory controller and one or more thermal sensors, where the one or more thermal sensors include a first thermal sensor located in a first area of the logic chip. The memory controller obtains thermal values of the one or more thermal sensors, where the logic element is to estimate thermal conditions for the memory stack using the thermal values, the determination of the estimated thermal conditions for the memory stack being based at least in part on a location of the first thermal sensor in the first area of the logic element. A refresh rate for one or more portions of the memory stack is modified based at least in part on the estimated thermal conditions for the memory stack.

Memory operations using system thermal sensor data

Technologies for implementing a secure boot using multiple firmware sources are described. One or more fuses of a processing device can be configured. Based on such configuration, one or more keys can be generated. Based on the configuration of the various fuses, an operation of a firmware device can be initiated. Using the generated key(s), a protected section of the firmware device can be accessed.

Method and apparatus for implementing a secure boot using multiple firmware sources

Dynamic memory performance throttling. An embodiment of a memory device includes a memory stack including coupled memory elements; the memory elements including multiple ranks, the plurality of ranks including a first rank and a second rank, and a logic device including a memory controller. The memory controller is to determine an amount of misalignment between data signals relating to a read request for the first rank and a read request for the second rank, and, upon determining that misalignment between the first rank and the second rank is greater than a threshold, the memory controller is to insert a time shift between a data signal for the first rank and a data signal for the second rank.

Dynamic memory performance throttling

Growing community of inventors

Los Altos Hills, CA, United States of America

Kenneth D Shoemaker