Hewlett-packard Company

Hewlett-packard Development Company, L.p.

Hewlett-packard Corporation

Hewlett-packard Development, L.p.

Kenneth D Saul

Joseph M Torgerson

Storrs Townsend Hoen

Leslie Ann Field

Phillip W Barth

Michael D Miller

Robert N K Browning

Todd A Cleland

Robert C Maze

Michael B Hager

Rama Prasad

Dale R Oughton

Douglas M Collins

Jefferson Patrick Ward

Mark H MacKenzie

Duane A Koehler

Huston W Rice

Angela White Bakkom

Victorio Chavarria

Valerie A Bach

The present invention includes as one embodiment a method of ejecting a fluid onto a print media. The method includes providing an ejection head having a nozzle that is coupled to a temperature sensor and a memory device. The method further includes measuring an uncalibrated temperature of the ejection head with the temperature sensor, recalling a correction value from the memory device, applying the correction value to the uncalibrated temperature to generate a calibrated temperature, and ejecting fluid from the nozzle onto the print media when the calibrated temperature is within a predefined temperature range.

Temperature calibration for fluid ejection head

Several improvements have been made in inkjet print cartridges to realize 5 ng drop weights at ejection frequencies of 18 KHz. These improvements include small nozzle openings, improved heater resistor efficiency, and better ink supply reliability.

High print quality inkjet printhead

A fluid ejection device includes a substrate, drop generators formed on the substrate at a high density, primitive select lines, and a ground line. The drop generators are arranged in primitives of drop generators. Each drop generator includes a heater resistor having a high resistance. Each primitive select line is separately electrically coupled to a corresponding one of the primitives and is configured to connect to a power source. The ground line is electrically coupled to all of the primitives.

High quality fluid ejection device

A high quality inkjet printhead includes a substrate having a multiplicity of heater resistors formed thereon at a density of at least six heater resistors per square millimeter. Each of the heater resistors also has a total resistance of at least 70 &OHgr; and an overlaying passivation thermal barrier characteristic adjusted to enable ejection of an ink drop of less than 6.5 ng with an energy impulse equal to or less than 1.4 &mgr;joules.

High print quality printhead

A fluid ejection device has a first set of primitives within a first region of a substrate of the device, and a second set of primitives within a second region of the substrate. The second set of primitives is electrically isolated from said first set of primitives. The number of primitives of said first set of primitives is different from the number of primitives of said second set of primitives.

Fluid ejection device controlled by electrically isolated primitives

In a thermal ink jet print head, individually-controlled heating elements are separated into groups of heating elements. Redundant control lines for the separate groups of heating elements increase the print head's reliability by reducing the likelihood that a print head will be completely disabled by an electrical fault on the control lines that in prior art devices extended to all of the heating elements.

Redundant input signal paths for an inkjet print head

A multi-layer structure, typically semiconductor device, is etched according to a process of the present invention, and meets the above-described existing needs by focusing on the post-etch treatment of the damaged, etched semiconductor device formed thereby. This post-etch treatment is accomplished by exposing the damaged silicon to a forming-gas downstream plasma which results in substantially increased oxide regrowth and significantly higher level of gate oxide quality. In conducting the process of the subject invention from about 1% up to about 15% by volume of H.sub.2, and from about 85 up to about 99% by volume of N.sub.2 are preferably employed as the post etching forming-gas plasma.

Process for semiconductor device etch damage reduction using

Growing community of inventors

Philomath, OR, United States of America

Kenneth D Saul