Verigy (singapore) Pte. Ltd.

Advantest (singapore) Pte Ltd

Kenneth D Karklin

Stephen Bellato

Sanjeev Grover

Alan D Hart

Todd Sholl

Benson Morris

James C Anderson

In one embodiment, a method for testing a plurality of singulated semiconductor die involves 1) placing each of the singulated semiconductor die on a surface of a die carrier, 2) mating an array of electrical contactors with the plurality of singulated semiconductor die, and then 3) performing electrical tests on the plurality of singulated semiconductor die, via the array of electrical contactors.

Methods, apparatus and articles of manufacture for testing a plurality of singulated die

There is disclosed apparatus for routing signals between at least one PCB within a test head and a socket card assembly. In an embodiment, the apparatus may include at least one flexible circuit electrically connecting first and second sides of the PCB and the socket card assembly with one another, and the flexible circuit having a defined shape configured to interface with the socket card assembly and the PCB along substantially perpendicular planes. Methods of routing signals between at least one PCB within a test head and a socket card assembly are disclosed. In one embodiment, a method may include electrically connecting first and second sides of the PCB and the socket card assembly with one another with at least one flexible circuit having a defined shape configured to interface with the socket card assembly and the PCB along substantially perpendicular planes. Other embodiments are also disclosed.

System, method and apparatus using at least one flex circuit to connect a printed circuit board and a socket card assembly that are oriented at a right angle to one another

Disclosed are various embodiments of electrical coupling apparatuses and methods. In one embodiment, an electrical coupling apparatus is provided having a first contact array on a card, where the first contact array is located at a first predefined position relative to an insertion edge of the card. The apparatus also includes a flexible printed circuit having a second contact array corresponding to the first contact array, where the second contact array is positioned in alignment with the first contact array. A compliant interposer material is positioned between the first and second contact arrays, the compliant interposer material electrically coupling respective pairs of contacts in the first and second contact arrays. Also, the insertion edge is configured to be inserted into a receptacle, the second contact array being positioned relative to the insertion edge so as to mate with a corresponding contact array in the receptacle when the insertion edge is inserted into the receptacle.

Electrical coupling apparatus and method

Growing community of inventors

Pasadena, CA, United States of America

Kenneth D Karklin