Occidental Chemical Corporation

Omi International Corporation

Hooker Chemicals & Plastics Corporation

Kenneth D Baker

Mohamed F El-Shazly

Yvonne Rymwid

Hans Scheider

An electroplating bath solution comprising an alkali metal or ammonium gold sulphite, a water soluble salt of thallium metal to effect brightening and grain refining, and a non-hydroxy, non-amino carboxylic acid such as formic acid and oxalic acid to ensure that the bright gold metal deposit has a hardness lower than about 90 Knoop. The method of depositing the bright gold metal on various substrates from such electroplating solutions is also described and claimed.

Gold sulphite electroplating solutions and methods

An electrolytic bath for the production of mirror bright silver deposits comprising an alkali metal silver cyanide as the source of silver; boric acid, citric acid, alkali or ammonium metal salts of such acids, as well as mixtures thereof; selenous acid or alkali metal selenite; and, in certain preferred baths, antimony in the form of an alkali metal carboxylic acid salt. The bath is designed to be operated at high current densities of from 200 to 5,000 ASF, i.e. about 20 to 500 ASD. The process of utilizing such as electrolytic bath is also disclosed and claimed.

High speed bright silver electroplating bath and process

Improved baths for the electrodeposition of ruthenium metal on various substrates. The ruthenium metal baths are formulated with a complex of ruthenium metal and sulphamic acid wherein the molar ratio is one mole of ruthenium metal and from about 4 to 10 moles of sulphamic acid. For most purposes, certain selective metals are also present in the baths, which are maintained at a pH ranging from about 1.0 to 2.2. The process for utilizing said baths to plate substrates with essentially pure ruthenium metal is also described and claimed.

Bath and process for the electrodeposition of ruthenium

An electroless plating process for depositing gold on substrates, such as metal and metallized substrates, which involves immersing the substrates in an electroless plating bath composed of a trivalent gold complex, an organic carboxylic acid, and/or a mineral acid sufficient in amount so that the pH of the bath will range from about 0.1 to 6.0. The process of utilizing said electroless bath to deposit gold on the aforementioned substrates is also disclosed and claimed.

Process for the immersion deposition of gold

Improved electroless or autocatalytic gold plating baths wherein the gold ingredient is a water soluble trivalent gold component selected from an alkali metal auricyanide, an alkali metal aurihydroxide, and an alkali metal aurate. The bath contains an amino borane, an alkali metal borohydride, or an alkali metal cyanoborohydride as the reducing agent; an alkaline agent such as an alkali metal hydroxide; and an alkaline buffering agent. Optionally, the bath may contain added alkali metal cyanide. The method of utilizing such electroless or autocatalytic plating bath for depositing gold on metallic substrates such as gold, copper, copper alloys, electroless copper, electroless nickel, nickel, nickel alloys, etc. and on a non-metallic substrates is also described and claimed.

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Bridgewater, NJ, United States of America

Kenneth D Baker