International Business Machines Corporation

Globalfoundries Inc.

Kenneth Charles Marston

Jeffrey Allen Zitz

Hilton T Toy

Kamal Kumar Sikka

Evan G Colgan

Paul F Bodenweber

Michael A Gaynes

Randall Jason Werner

Jon Alfred Casey

John Harold Magerlein

Jennifer V Muncy

Steven Paul Ostrander

Xiaojin Wei

Ronald L Hering

Paul William Coteus

Charles Leon Arvin

Michael Stephen Floyd

Benjamin V Fasano

Raschid Jose Bezama

David L Questad

Sushumna Iruvanti

Roger Donell Weekly

Shidong Li

Frank Louis Pompeo

John Saunders Corbin, Jr

Janak G Patel

David Hirsch Danovitch

Patrick Anthony Coico

Virendra R Jadhav

Sylvain E Ouimet

Soraya Ghiasi

James H Covell

Eric Salvas

Marcus E Interrante

Sundar M Kamath

Kathryn C Rivera

Karl Joseph Puttlitz

Louis-Marie Achard

Kevin Drummond

Isabelle Depatie

Roger A Liptak

Lewis S Goldman

Roger R Schmidt

David Clifford Long

Malcolm Scott Ware

Thomas J Brunschwiler

David L Edwards

Bruce Kenneth Furman

John Lee Colbert

Amilcar R Arvelo

Roger Duane Hamilton

Glenn Graham Daves

Jason R Eagle

Tuhin Sinha

Jamil A Wakil

Jay A Bunt

Jiantao Zheng

Hongqing Zhang

Taryn J Davis

Jason Scott Miller

David J Lewison

Chris Muzzy

Chenzhou Lian

Luca Del Carro

Stephanie Allard

Malcom S Ware

An electronic apparatus that includes a semiconductor device; an electronic packaging substrate for receiving the semiconductor device; a thermal interface material on the semiconductor device; and a lid in contact with the thermal interface material and having a zone of targeted flexibility spaced from the semiconductor device.

Lid/heat spreader having targeted flexibility

A heat spreader is disclosed with regions where material is absent to reduce the mass/weight of the heat spreader without substantially reducing the temperature of the semiconductor chip and without substantially affecting the warpage and mechanical stress/strain in the electronic package.

Optimized weight heat spreader for an electronic package

An IC device package includes a carrier, one or more IC devices and a lid. The lid includes a lid-ridge. The lid is connected to the carrier by connecting the lid-ridge to the carrier with first nano particle metallic paste, prior to connecting the IC device to the carrier. Subsequent to connecting the IC device to the carrier, the lid is connected to the lid-ridge with second nano particle metallic paste. The nano particle metallic paste may be sintered to form a metallic connection. In multi-IC device packages, the lid-ridge may be positioned between the lid and the carrier and between the IC devices.

Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste

An IC device package includes an IC device that is connected to a lid by a thermal interface material (TIM). A catalyst material is formed upon one or more regions upon an upper surface of the IC device and/or an under surface of the lid. The catalyst material increases the rate of crosslinking of polymer chains of the TIM during TIM curing and/or increases the strength of crosslinks that link polymer chains of the TIM during TIM curing. The catalytically enhanced regions have a higher coefficient of heat transfer relative to non-catalytically enhanced regions. Therefore, the catalytically enhanced regions efficiently transfer heat from the IC device to the lid.

Localized catalyst for enhanced thermal interface material heat transfer

A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.

Cooling structure for electronic boards

Structures and methods for providing heat sink attachments on existing heat sinks. According to a device, a first heat sink comprises a first base and fins extending from the first base. The first base comprises a cutout therein and a first base bottom surface contacting a first electronic component. A second heat sink comprises a second base and fins extending from the second base. The second heat sink is located in the cutout of the first heat sink. The second base comprises a second base bottom surface contacting a second electronic component. A pressure plate is attached to the first heat sink and overlays the second heat sink. The pressure plate contacts the second heat sink and applies pressure between the second heat sink and the second electronic component.

Heat sink attachment on existing heat sinks

A semiconductor device package which includes a semiconductor package, a semiconductor device joined to the semiconductor package; and a lid to be placed over the semiconductor device and joined to the semiconductor package. The lid includes: a block of a first material having a first surface and a second surface, the second surface facing the semiconductor device, the block having perforations extending between the first surface and the second surface; inserts for filling the perforations, each of the inserts being made of a second material, at least one of the inserts protrudes beyond the second surface towards the semiconductor device; and a bonding material to bond the inserts to the block so that the at least one of the inserts protrudes beyond the second surface towards the semiconductor device. Also included is a method of assembling a semiconductor device package.

Thermal hot spot cooling for semiconductor devices

Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.

Precast thermal interface adhesive for easy and repeated, separation and remating

Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.

Semiconductor package structures having liquid cooler integrated with first level chip package modules

A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.

Achieving mechanical and thermal stability in a multi-chip package

Growing community of inventors

Wappingers Falls, NY, United States of America

Kenneth Charles Marston