Trw Limited

Kenneth C Selk

William D Bjorndahl

Alfred Euinam Lee

Roger A Davidheiser

D Ian Stones

William E McMullen

Cindy S Fietze

James Carl Canyon

Alexander Krayner

Harold J Hirsch

Rene R Martinez

M David Saferstein

Frederick M Gower

A multilayer wiring board comprises a substrate having a plurality of layers of reinforced resin material &prime;, a patterned conductive layer &prime; provided on at least one major surface of the substrate, a plurality of via holes provided at least partly through the substrate, and a plurality of signal carrying wires &prime;. The signal carrying wires &prime; are provided between at least two of the layers of reinforced resin material &prime;. The signal carrying wires &prime; can be embedded in a resin layer &prime;, and the resin layer &prime; sandwiched between a pair of the layers of reinforced resin material. The reinforced resin material is preferably a fiber reinforced resin material, such as a glass fiber reinforced epoxy or polyimide material. In some applications, a constrained core &prime;, e.g., a copper/ molybdenum/copper laminate, can be provided between a major surface of the substrate and the pair of reinforced resin layers sandwiching the signal carrying wires &prime;. The board can be used in a multilayer wiring package wherein a plurality of integrated circuit chips are mounted on a major surface of the board . Applications include digital, high-speed digital and RF interconnects.

Multilayer wiring board and multilayer wiring package

A high frequency coaxial interconnection solder ball grid array produces a low loss, reproducible electrical interconnection at the circuit board level for mounting one or more high frequency components, such as high frequency IMA modules. Since the coaxial interconnection ball grid array can be and is generally implemented as part of a larger ball grid array, high frequency signal generation, signal reception and digital processing can be combined in a single electronic component, such as a circuit board. A coaxial-like interconnection is formed from a plurality of solder balls configured in a three-by-three square array. The coaxial interconnection solder ball grid array includes a single centrally disposed solder ball for interconnecting with a centrally disposed conductor of a coaxial line and a plurality of solder balls surrounding the single centrally disposed solder ball, some balls of which interconnect with a coaxial ground shield of the coaxial line. When soldered together, the centrally disposed solder ball and the central conductor of the coaxial line have the appearance of a rod with a diameter having a standard 50 ohm impedance. The outer conductive shield or ground signal path of the coaxial line is connected with multiple solder balls, to achieve a lower inductance ground-to-ground connection.

Solder ball grid array for connecting multiple millimeter wave assemblies

A shielded printed wiring board is disclosed which provides electrical and magnetic isolation for the signal layers located thereon. The printed wiring board includes a signal layer laminated between two non-conductive dielectric layers. The bottom side of the printed wiring board has a conductive layer coated thereon. Grooves are routed through the printed circuit board on both sides of each signal layer extending from the top layer partially through to the conductive layer. Conductive metallic coatings are then provided to coat the board and thereby encapsulate the signal layer in a ground envelope, separated by a controlled thickness dielectric. In an alternate embodiment, a plurality of layers are laminated one on top of the other to provide a multilayer printed wiring board.

Shielded multilayer printed wiring board, high frequency, high isolation

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Hermosa Beach, CA, United States of America

Kenneth C Selk